Abstract: Synthetic resin leather includes a base material, and a skin layer that is stacked on the base material and is made of a synthetic resin capable of being elastically deformed. Multiple micro recess parts are intermittently and regularly formed on a surface of the skin layer. The multiple micro recess parts form multiple bottom face parts that are located at a substantially constant depth from the surface of the skin layer, and multiple inner side face parts that extend from the surface of the skin layer to the multiple bottom face parts and are capable of being elastically deformed.

Abstract: Provided is a vehicle hook apparatus capable of preventing damage to a predetermined component that receives a load applied to a hook member. The vehicle hook apparatus includes a hook member provided to be displaceable between a storage position where the hook member is stored by being tilted to a side of a predetermined component and a use position where the hook member is used by being raised from the side of the predetermined component. The hook member includes a locking portion locking to the predetermined component when a first load is applied in a direction in which the hook member is further raised from the use position, and a weak portion deformed to unlock the locking portion from the predetermined component, when a second load exceeding the first load is applied at the use position.

Abstract: There is provided a corrosion management system including: a measurement data acquisition unit that acquires measurement data indicating the corrosion state of a first portion of a structure which is an evaluation target; and a corrosion estimation unit that estimates the corrosion state of a second portion of the evaluation target based on the relational expression between the corrosion state of the first portion and the corrosion state of the second portion, and the measurement data of the first portion.

Abstract: A method for detecting abnormal growth of graphene includes: measuring, through spectroscopic ellipsometry, a reflection spectrum of a measurement object having a graphene film formed through CVD on a substrate; creating a film structure model, calculating polarization parameters, and matching calculated values of the polarization parameters to measured values through fitting; and detecting abnormal growth of the graphene based on a value of goodness of fit obtained when fitting the polarization parameters.

Abstract: A photodetector according to the present disclosure includes: a light-receiving circuit including a light-receiving element, and being configured to detect a light pulse reflected by a detection target among light pulses emitted from a light-emitting section; a conversion circuit being configured to calculate a digital value corresponding to a light-receiving timing in the light-receiving circuit; a histogram generation circuit being configured to generate a first histogram on a basis of the digital value; a correction processing circuit being configured to generate a second histogram by performing correction processing on the first histogram using a light-receiving characteristic that is asymmetric in a direction of a time axis in the light-receiving element; and a calculation circuit being configured to calculate a representative value of the light-receiving timing on a basis of the second histogram.

Abstract: Provided are a processing device, a detecting system, a processing method, a program, and a storage medium that obtain a position of a weld portion of a joined body with higher accuracy. A processing device according to an embodiment receives intensity data of a reflected wave obtained by transmitting an ultrasonic wave along a first direction toward a joined body. The device designates a weld portion of the joined body by using the intensity data. The device calculates a first center position of the weld portion in a first plane crossing the first direction.

Abstract: According to one embodiment, an inspection system includes a probe and a controller. The probe includes a plurality of ultrasonic sensors arranged in a first direction. The probe contacts a weld portion by moving in a second direction crossing the first direction. Each of the plurality of ultrasonic sensors transmits an ultrasonic wave toward the weld portion and receives a reflected wave. The controller detects a joint and a non-joint at a plurality of points along the first direction of the weld portion based on the plurality of reflected waves. The controller adjusts an angle of the probe around a third direction based on a number of the joints or the non-joints detected for the plurality of points. The third direction is perpendicular to the first direction and crosses the second direction.

Abstract: Provided is a vehicle hook apparatus capable of preventing damage to a predetermined component that receives a load applied to a hook member. The vehicle hook apparatus includes a hook member provided to be displaceable between a storage position where the hook member is stored by being tilted to a side of a predetermined component and a use position where the hook member is used by being raised from the side of the predetermined component. The hook member includes a locking portion locking to the predetermined component when a first load is applied in a direction in which the hook member is further raised from the use position, and a weak portion deformed to unlock the locking portion from the predetermined component, when a second load exceeding the first load is applied at the use position.

Abstract: According to one embodiment, an inspection system includes a probe and a controller. The probe includes a plurality of ultrasonic sensors arranged in a first direction. The probe contacts a weld portion by moving in a second direction crossing the first direction. Each of the plurality of ultrasonic sensors transmits an ultrasonic wave toward the weld portion and receives a reflected wave. The controller detects a joint and a non-joint at a plurality of points along the first direction of the weld portion based on the plurality of reflected waves. The controller adjusts an angle of the probe around a third direction based on a number of the joints or the non-joints detected for the plurality of points. The third direction is perpendicular to the first direction and crosses the second direction.

Abstract: According to one embodiment, an inspection system includes a probe and a controller. The probe includes a plurality of ultrasonic sensors arranged in a first direction. The probe contacts a weld portion by moving in a second direction crossing the first direction. Each of the plurality of ultrasonic sensors transmits an ultrasonic wave toward the weld portion and receives a reflected wave. The controller detects a joint and a non-joint at a plurality of points along the first direction of the weld portion based on the plurality of reflected waves. The controller adjusts an angle of the probe around a third direction based on a number of the joints or the non-joints detected for the plurality of points. The third direction is perpendicular to the first direction and crosses the second direction.

Abstract: According to one embodiment, an inspection system includes a probe and a controller. The probe includes a plurality of ultrasonic sensors arranged in a first direction. The probe contacts a weld portion by moving in a second direction crossing the first direction. Each of the plurality of ultrasonic sensors transmits an ultrasonic wave toward the weld portion and receives a reflected wave. The controller detects a joint and a non-joint at a plurality of points along the first direction of the weld portion based on the plurality of reflected waves. The controller adjusts an angle of the probe around a third direction based on a number of the joints or the non-joints detected for the plurality of points. The third direction is perpendicular to the first direction and crosses the second direction.

Abstract: A low profile antenna device for use in a vehicle comprises a base unit, and an antenna unit. The antenna unit is supported on the base unit, and is provided with a first helical unit on the side near to the base unit, and a second helical unit on the side far from the base unit. The second helical unit is configured such that the surface area is larger per unit length than that of the first helical unit.

Abstract: A three-dimensional ultrasonic inspection apparatus 10 can make increased inspection accuracy in comparison to the conventional apparatus and includes: an ultrasonic transducer 11 disposed m×n piezoelectric vibrators in a matrix; a signal processing unit 17 to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; a peak detecting element 51, 52 to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction; a joint portion image creation unit 36 to create a three-dimensional image of the joined area 15 by mapping z direction distance of the first peak and the second peak to x-y plane; a determination unit 37 to determine whether the joined area 15 is sound by two-step determination; and a display unit 38 to display the three-dimensional image and the determination result, of the joined area 15.

Abstract: A low profile antenna device for use in a vehicle comprises a base unit, and an antenna unit. The antenna unit is supported on the base unit, and is provided with a first helical unit on the side near to the base unit, and a second helical unit on the side far from the base unit. The second helical unit is configured such that the surface area is larger per unit length than that of the first helical unit.

Abstract: A three-dimensional ultrasonic inspection apparatus includes: an ultrasonic transducer disposed m×n piezoelectric vibrators in a matrix; a signal processing device to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; and a display processing device to display a result of processing the three-dimensional image data generated by the signal processing device, wherein the display processing device includes a peak detecting unit to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction, a joint portion image creation unit to create a three-dimensional image of the joined area by mapping z direction distance of the first peak and the second peak to x-y plane, a determination unit to determine whether the joined area is sound or not, and a display unit to display the three-dimensional image and the determination result of the joined area.

Abstract: The present invention is intended to provide a glass substrate (20), made of an insulating material, which can constitute a semiconductor apparatus (10) by transferring a single crystal silicon film (50) or a substrate including a semiconductor device onto a surface (24) of the insulating substrate, a transferred surface (26) being part of the surface (24), the single crystal silicon film (50) capable of being provided on the transferred surface (26), and the transferred surface (26) having an arithmetic mean roughness of not more than 0.4 nm.

Abstract: A semiconductor device (130) includes: a bonding substrate (100); a thin film element (80) formed on the bonding substrate (100); and a semiconductor element (90) bonded to the bonding substrate (100), the semiconductor element (90) including semiconductor element main body (50) and a plurality of underlying layers (51-54) stacked on a side of the semiconductor element main body (50) facing the bonding substrate (100), and each of the underlying layers (51-54) including an insulating layer and a circuit pattern in the insulating layer, wherein an end of the semiconductor element (90) facing the thin film element (80) is provided in a stepped form so that the closer to the bonding substrate the underlying layers arc, the farther ends of the underlying layers facing the thin film element protrude, the end of the semiconductor element (90) is covered with a resin layer (120), and the thin film element (80) is connected to the semiconductor element main body (50) via a connection line (121a) provided on the resin

Abstract: Provided is a semiconductor device manufacturing method wherein the following steps are performed; a step of forming at least a part of an element on a base body layer, a step of forming a peeling layer, a step of forming a planarizing film; a step of forming a die by separating the base body layer at a separating region; a step of bonding the die to a substrate by bonding the die on the planarizing film; and a step of peeling and removing a part of the base body layer along the peeling layer. Prior to the step of forming the die, a step of forming a groove opened on the surface of the planarizing film such that at least a part of the separating region is included on the bottom surface of the groove, and forming the die such that the die has a polygonal outer shape wherein all the internal angles are obtuse by forming the groove is performed.

Abstract: A semiconductor device (130) including: a bonding substrate (100); a thin film element (80) formed on the bonding substrate (100); and a semiconductor element (90a) bonded to the bonding substrate (100), the semiconductor element including a semiconductor element main body (50) and a plurality of underlying layers (51-54) stacked on a side of the semiconductor element main body facing the bonding substrate (100), wherein the underlying layer (54) closest to the bonding substrate (100) includes an extended section (E) formed by extending the circuit pattern toward the thin film element (80), a resin layer (120) is provided between the thin film element (80) and the semiconductor element (90a), and the thin film element (80) is connected to the semiconductor element main body (50) via a connection line (121a) provided on the resin layer (120), the extended section (E), and the circuit patterns.

Abstract: A three-dimensional ultrasonic inspection apparatus 10 can make increased inspection accuracy in comparison to the conventional apparatus and includes: an ultrasonic transducer 11 disposed m×n piezoelectric vibrators in a matrix; a signal processing unit 17 to receive, detect an echo, and generate a three-dimensional image data by processing an electric signal of the echo detected; a peak detecting element 51, 52 to detect a first peak and a second peak of an intensity distribution of the three-dimensional image data in a depth (z) direction; a joint portion image creation unit 36 to create a three-dimensional image of the joined area 15 by mapping z direction distance of the first peak and the second peak to x-y plane; a determination unit 37 to determine whether the joined area 15 is sound by two-step determination; and a display unit 38 to display the three-dimensional image and the determination result, of the joined area 15.