Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.

Abstract: An apparatus includes a lighting unit configured to irradiate a light emitting device package including a light transmitting resin containing a light conversion material with light having a certain color; a camera configured to capture an image of the light emitting device package; and a controller configured to determine color coordinates of the light emitting device package using the image, captured by the camera, to determine whether the light emitting device package is defective.

Abstract: A resin dispensing apparatus is provided. The resin dispensing apparatus includes an external body portion including a discharge nozzle configured to discharge a phosphor-containing resin, and an internal body portion including at least one flow passage, the internal body portion being mounted within the external body portion. An axial length of the internal body portion is shorter than an axial length of the external body portion.

Abstract: Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.

Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Abstract: A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.