Abstract: A fabrication method of a projective-capacitive touch panel is provided. The method includes steps of: providing a substrate; forming a metal trace layer on the substrate with a first exposing/developing process and a etching/stripping process sequentially; forming a first pattern layer on the metal trace layer with a second exposing/developing process, a first filming process and a first stripping process sequentially; forming a insulation layer on the first pattern layer; and forming a second pattern layer on the insulation layer with a third exposing/developing process, a second filming process and a second stripping process sequentially.

Abstract: A heating dissipating device for electronic elements comprises a bottom plate and a plurality of heat dissipating sheets; the bottom plate being formed with a plurality of grooves. A lower end of each heat dissipating sheet is a folded end and the folded end is inserted into a respective groove to be fixed therein tightly. Each groove may be inclined with respect to the surface of the bottom plate and the fold end is also inclined. Moreover, two sides of the bottom plate are punched so that the heat dissipating sheets are tightly engaged to the bottom plate.