Abstract: A latch mechanism for securing an expansion card assembly in a computer chassis includes a lever, a stop member, a rotary latch, a first biasing structure, and a second biasing structure. The lever includes a latching end and an opposing pinned end. The stop member extends from the pinned end. The rotary latch is connected to the latching end and includes a receiving chamber and a hook structure. The hook structure includes a notch for receiving a stop pin. The first biasing structure extends from the lever into the receiving chamber and is configured to urge the rotary latch into a locked position. The second biasing structure is configured to urge the lever about the pinned end to an open position.

Abstract: A latch mechanism for securing an expansion card assembly in a computer chassis includes a lever, a stop member, a rotary latch, a first biasing structure, and a second biasing structure. The lever includes a latching end and an opposing pinned end. The stop member extends from the pinned end. The rotary latch is connected to the latching end and includes a receiving chamber and a hook structure. The hook structure includes a notch for receiving a stop pin. The first biasing structure extends from the lever into the receiving chamber and is configured to urge the rotary latch into a locked position. The second biasing structure is configured to urge the lever about the pinned end to an open position.

Abstract: An air-duct module for a server comprises a main body that includes an upper wall and a plurality of side walls extending downwardly away from the upper wall. The main body further includes a plurality of channel walls extending from the upper wall and defining a cable-routing channel located within the main body. The cable-routing channel receives an electronics cable that extends across the main body. The air-duct module has an air passage for guiding air across a heat exchanger within the server. The air-duct passage is defined by the upper wall, the plurality of side walls, and at least some of the plurality of channel walls.

Abstract: An air-duct module for a server comprises a main body that includes an upper wall and a plurality of side walls extending downwardly away from the upper wall. The main body further includes a plurality of channel walls extending from the upper wall and defining a cable-routing channel located within the main body. The cable-routing channel receives an electronics cable that extends across the main body. The air-duct module has an air passage for guiding air across a heat exchanger within the server. The air-duct passage is defined by the upper wall, the plurality of side walls, and at least some of the plurality of channel walls.

Abstract: An air-duct assembly for a server comprises a main portion and an extension piece. The main portion has a first end region for receiving air from a fan and a second end region with a first attachment feature. The extension piece has a second attachment feature for mating with the first attachment feature. The extension piece guides the air from the second end region of the main portion to a terminal end of the extension piece. The air-duct assembly can be used with a first heat exchanger in a first configuration in which the extension piece is mated to the main portion, and the first heat exchanger is located within the extension piece. The air-duct assembly can also be used with a second heat exchanger in a second configuration in which only the main portion is used by itself and the second heat exchanger is located within the main portion.

Abstract: A computer chassis can include a top cover that can be secured and removed without the need for tools. Sidewalls of a chassis base can include receiving slots that receive bosses of the top cover. A latch receiver mounted to a bottom surface of the chassis base can receive a sliding body of a latch assembly of the top cover. The computer chassis can be assembled by placing the top cover on the chassis base such that the bosses are placed into the receiving slots, and such that the sliding body fits within the latch receiver. In this position, rotation of a lever of the latch assembly can force the top cover to move with respect to the chassis base, pushing the bosses of the top cover towards distal ends of the receiving slots of the chassis base, thus securing the top cover to the chassis base.

Abstract: Described herein are modular server systems. The server systems include a server chassis having one or more window bays each having the same dimensions. The system also includes a plurality of device trays each for holding a device that is selected from a plurality of different devices. Each device tray fits in the one or more window bays.

Abstract: An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

Abstract: An adaptor assembly for an OCP 2.0 form factor card for installation in a server having a side slot to accommodate OCP 3.0 form factor cards is disclosed. The adaptor assembly has an adaptor board allowing the attachment of the OCP 2.0 form factor. The adaptor board includes a socket mateable with a connector on the OCP 2.0 form factor and an edge connector mateable with a socket on the server. The assembly includes an adaptor bracket attachable to the adaptor board. The adaptor bracket has a wall that covers the side slot of the server when the adaptor assembly is inserted through the side slot.

Abstract: In the production of certain components, the components must pass through an existing treating device with limited clearance. This limited clearance will cause unwanted physical contact between the component and the existing treatment apparatus, such as a reflow oven for treating electronic components, such as an M.2 connector. In such a situation, it will be necessary to practice a method of separating the component into subassemblies or modules; separately treating the subassemblies or modules in the reflow oven; and then reassembling the subassemblies and modules after the reflow treatment.

Abstract: The present disclosure provides a cover configured to fit over computer components in a computer chassis. The cover can have a plurality of doors located over the computer components such that the computer components can be easily inserted or removed from the chassis when a corresponding door is open. The cover can be shaped in a such a way so as to define airflow passages around the computer components. The doors can be configured to pivot open, slide open, or snap into and out of the cover.

Abstract: An adapter bracket configured to be mounted within a carrier device is provided. The adapter bracket includes a receiving space configured to receive a storage module, a first wall element located on one side of the receiving space, and a second wall element located opposite of the first wall element. The adapter bracket also includes receiving elements located between the first wall element and the second wall element. The receiving elements are configured to receive a securing element through an aperture on the storage module.

Abstract: In the production of certain components, the components must pass through an existing treating device with limited clearance. This limited clearance will cause unwanted physical contact between the component and the existing treatment apparatus, such as a reflow oven for treating electronic components, such as an M.2 connector. In such a situation, it will be necessary to practice a method of separating the component into subassemblies or modules; separately treating the subassemblies or modules in the reflow oven; and then reassembling the subassemblies and modules after the reflow treatment.