Abstract: In one embodiment, a light emitting panel includes a base panel and a plurality of light emitting elements mounted to the base panel. Each of the light emitting elements produces an illumination pattern having a region of substantially uniform intensity that extends over a radiation angle of at least about 60°. One or more light conditioners are positioned adjacent the base panel to receive and condition light produced by the light emitting elements.

Abstract: There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.