Abstract: A chip package assembly and method for fabricating the same are provided which utilize a stiffener to improve a package substrate against out of plane deformation. In one example, a chip package assembly is provided that includes a package substrate, at least one integrated circuit (IC) die and a stiffener. The package substrate has a first surface and a second surface coupled by a side wall. The at least one IC die is disposed on the first surface of the package substrate. The stiffener is disposed outward of the at least one IC die. The stiffener has a first surface disposed outward of and bonded to the side wall of the package substrate. The stiffener has a second surface bonded to at least one of the first and second surfaces of the package substrate.

Abstract: A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.

Abstract: A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed.