Patents by Inventor Shin Sakiyama

Shin Sakiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7474109
    Abstract: A contact terminal for measurement is provided, for transmitting a signal between a desired probe pin among a plurality of probe pins arranged in parallel at a predetermined distance in a predetermined direction on the surface of a probe substrate and an external measurement apparatus. The contact terminal for measurement includes: a signal terminal having an width smaller than the distance between the probe pins provided on both sides of one probe pin in the arrangement direction; two ground terminals to which a ground potential is applied, which are provided on both sides of the signal terminal in the arrangement direction and which have each width larger than that of the signal terminal in the arrangement direction; and a signal line electrically connecting the signal terminal to a signal input terminal of the external measurement apparatus.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: January 6, 2009
    Assignee: Advantest Corporation
    Inventors: Tetsuya Kuitani, Tadao Saito, Shigeru Matsumura, Shin Sakiyama
  • Publication number: 20070145994
    Abstract: A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a surface of the housing, which faces the BGA unit, in order to the through-hole corresponds the plurality of ball contacts and a pin contact provided in a plurality of through-holes and contacting a corresponding side part of the ball contact. More desirably, the plurality of pin contacts is provided in order that each extending directions of the pin contacts are opposite to one another.
    Type: Application
    Filed: February 22, 2007
    Publication date: June 28, 2007
    Applicant: Advantest Corporation
    Inventor: Shin Sakiyama
  • Patent number: 7202686
    Abstract: A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a surface of the housing, which faces the BGA unit, in order to the through-hole corresponds the plurality of ball contacts and a pin contact provided in a plurality of through-holes and contacting a corresponding side part of the ball contact. More desirably, the plurality of pin contacts is provided in order that each extending directions of the pin contacts are opposite to one another.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: April 10, 2007
    Assignee: Advantest Corporation
    Inventor: Shin Sakiyama
  • Publication number: 20070007984
    Abstract: A socket for an inspection apparatus for connecting an inspection circuit board and an inspected device includes: a plate-like housing including a first surface opposed to a surface on which a terminal of the inspected device is disposed and a second surface opposed to a surface on which an electrode of the inspection circuit board is disposed, the housing having a terminal-receiving holes which extends through the housing in the thickness direction thereof; and a connection terminal attached to the housing for electrically conducting the terminal of the inspected device and the electrode of the inspection circuit board, the connection terminal including a elastically deformable one-piece member which is a bent elongated member and being held in the terminal-receiving hole in the housing so as to be movable in the thickness direction of the housing.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 11, 2007
    Applicants: Molex Japan Co., Ltd., Advantest Corporation
    Inventors: Yutaka Kojima, Hiroyuki Hama, Shintaro Takaki, Shin Sakiyama
  • Publication number: 20060279304
    Abstract: A contact terminal for measurement is provided, for transmitting a signal between a desired probe pin among a plurality of probe pins arranged in parallel at a predetermined distance in a predetermined direction on the surface of a probe substrate and an external measurement apparatus. The contact terminal for measurement includes: a signal terminal having an width smaller than the distance between the probe pins provided on both sides of one probe pin in the arrangement direction; two ground terminals to which a ground potential is applied, which are provided on both sides of the signal terminal in the arrangement direction and which have each width larger than that of the signal terminal in the arrangement direction; and a signal line electrically connecting the signal terminal to a signal input terminal of the external measurement apparatus.
    Type: Application
    Filed: May 22, 2006
    Publication date: December 14, 2006
    Applicant: Advantest Corporation
    Inventors: Tetsuya Kuitani, Tadao Saito, Shigeru Matsumura, Shin Sakiyama
  • Publication number: 20060121752
    Abstract: A socket electrically coupled to a BGA unit includes a plurality of ball contacts including a housing wherein a through-hole having a larger diameter than that of the ball contact is formed in a surface of the housing, which faces the BGA unit, in order to the through-hole corresponds the plurality of ball contacts and a pin contact provided in a plurality of through-holes and contacting a corresponding side part of the ball contact. More desirably, the plurality of pin contacts is provided in order that each extending directions of the pin contacts are opposite to one another.
    Type: Application
    Filed: January 23, 2006
    Publication date: June 8, 2006
    Applicant: Advantest Corporation
    Inventor: Shin Sakiyama
  • Patent number: D581876
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: December 2, 2008
    Assignees: Tyco Electronics AMP K.K., Advantest Corporation
    Inventors: Takahiro Hatano, Makiya Kimura, Tomoyuki Takamoto, Shin Sakiyama, Takashi Sekizuka
  • Patent number: D583769
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: December 30, 2008
    Assignees: Tyco Electronics AMP K.K., Advantest Corporation
    Inventors: Takahiro Hatano, Makiya Kimura, Tomoyuki Takamoto, Shin Sakiyama, Takashi Sekizuka