Patents by Inventor Shin Shern Low

Shin Shern Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-enhanced integrated circuit package
    Publication number: 20040021213
    Abstract: A packaged integrated circuit including a substrate 520 including a metal grid 570, 580 over a top surface of the substrate and an integrated circuit chip 500 mounted on the substrate over the grid. The metal grid can be electrically isolated from the integrated circuit or it can be electrically connected to the integrated circuit, through electrical ground for example.
    Type: Application
    Filed: August 5, 2002
    Publication date: February 5, 2004
    Inventors: Shin Shern Low, Mike Pierce