Patents by Inventor Shin-Tai Ho

Shin-Tai Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10601184
    Abstract: A transmission wafer includes an insulating frame, a plurality of signal terminals each partially fixed in the insulating frame, and a shielding member fixed on the insulating frame. The insulating frame includes a front end portion and a bottom end portion both substantially perpendicular to each other, and the bottom end portion has a plurality of retaining structures. Each of the signal terminals includes a mounting segment protruding from the bottom end portion, and the shielding member includes a plurality of mounting portions each partially protruding from the bottom end portion. The mounting portions and the mounting segments are arranged in a row, and the mounting portions are respectively retained by the retaining structures of the insulating frame.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: March 24, 2020
    Assignee: STARCONN ELECTRONICS (SU ZHOU) CO., LTD
    Inventors: Chih-Wei Chen, Yueh-Lin Yang, Shin-Tai Ho, Yu-Hsiung Lin
  • Publication number: 20190305488
    Abstract: A transmission wafer includes an insulating frame, a plurality of signal terminals each partially fixed in the insulating frame, and a shielding member fixed on the insulating frame. The insulating frame includes a front end portion and a bottom end portion both substantially perpendicular to each other, and the bottom end portion has a plurality of retaining structures. Each of the signal terminals includes a mounting segment protruding from the bottom end portion, and the shielding member includes a plurality of mounting portions each partially protruding from the bottom end portion. The mounting portions and the mounting segments are arranged in a row, and the mounting portions are respectively retained by the retaining structures of the insulating frame.
    Type: Application
    Filed: June 19, 2018
    Publication date: October 3, 2019
    Inventors: CHIH-WEI CHEN, YUEH-LIN YANG, SHIN-TAI HO, YU-HSIUNG LIN
  • Patent number: 9300096
    Abstract: A power connector includes a conductive module and an insulating member. The conductive module includes a metal seat and a conductive pin at least partially protruding from the metal seat. The metal seat is configured to be installed on a first electronic device. The conductive pin is configured to insertably connect to a second electronic device. The insulating member covers part of the outer surface of the conductive module, and the conductive module has a contact portion exposed from the insulating member. The contact portion and the conductive pin are provided with electrical connection. The contact portion is configured to electrically connect to the first electronic device when the metal seat is installed on the first electronic device. The conductive pin is configured to electrically connect to the second electronic device when inserting into the second electronic device.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: March 29, 2016
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventors: Chin-Hsiang Chou, Shin-Tai Ho, Chi-Tien Shih, Yueh-Lin Yang
  • Patent number: D827581
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: September 4, 2018
    Assignee: CHIEF LAND ELECTRONIC CO., LTD.
    Inventor: Shin-Tai Ho
  • Patent number: D945372
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: March 8, 2022
    Assignee: STARCONN ELECTRONIC (SU ZHOU) CO., LTD
    Inventors: Chih-Wei Chen, Yueh-Lin Yang, Shin-Tai Ho, Yu-Hsiung Lin