Abstract: A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.

Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Abstract: There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance.

Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.

Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.

Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

Abstract: A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.

Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

Abstract: There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.