Patents by Inventor Shin Takanezawa

Shin Takanezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200404783
    Abstract: Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.
    Type: Application
    Filed: December 10, 2018
    Publication date: December 24, 2020
    Inventors: Mari SHIMIZU, Daisuke FUJIMOTO, Yasuo KAMIGATA, Tomohiko KOTAKE, Shin TAKANEZAWA, Akira SHIMIZU, Harumi NEGISHI, Kouichi AOYAGI, Sayaka KIKUCHI
  • Patent number: 10681807
    Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 9, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shinji Tsuchikawa, Shin Takanezawa
  • Publication number: 20200107437
    Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
    Type: Application
    Filed: March 28, 2018
    Publication date: April 2, 2020
    Inventors: Norihiko SAKAMOTO, Hiroshi YOKOTA, Shintaro HASHIMOTO, Katsuhiko NAWATE, Shinji TSUCHIKAWA, Shin TAKANEZAWA
  • Publication number: 20200056006
    Abstract: The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.
    Type: Application
    Filed: March 28, 2018
    Publication date: February 20, 2020
    Inventors: Hiroshi YOKOTA, Shintaro HASHIMOTO, Norihiko SAKAMOTO, Shinji TSUCHIKAWA, Katsuhiko NAWATE, Shin TAKANEZAWA
  • Patent number: 10465089
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: November 5, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai
  • Publication number: 20190218415
    Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: Masaki MORITA, Konatsu NAKAMURA, Shin TAKANEZAWA
  • Patent number: 10323126
    Abstract: A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: June 18, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake, Shin Takanezawa, Hikari Murai
  • Publication number: 20190182953
    Abstract: Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150° C. to 230° C. in an amount of 10% by mass or more in a total amount of the residual solvent.
    Type: Application
    Filed: August 14, 2017
    Publication date: June 13, 2019
    Inventors: Masaharu MATSUURA, Nobuyuki OGAWA, Shin TAKANEZAWA, Yasuyuki MIZUNO
  • Publication number: 20190002728
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Inventors: Kouji MORITA, Hikari MURAI, Shin TAKANEZAWA, Yasuo INOUE, Kazunaga SAKAI
  • Patent number: 10119047
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: November 6, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai, Tetsurou Irino
  • Publication number: 20160083614
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Application
    Filed: November 12, 2015
    Publication date: March 24, 2016
    Inventors: Kouji MORITA, Hikari MURAI, Shin TAKANEZAWA, Yasuo INOUE, Kazunaga SAKAI
  • Patent number: 9265145
    Abstract: The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: February 16, 2016
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai
  • Patent number: 9133308
    Abstract: There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: September 15, 2015
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shunsuke Nagai, Masato Miyatake, Tomohiko Kotake, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai
  • Publication number: 20150203715
    Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.
    Type: Application
    Filed: March 31, 2015
    Publication date: July 23, 2015
    Inventors: Tomohiko KOTAKE, Shinji TSUCHIKAWA, Hiroyuki IZUMI, Masato MIYATAKE, Shin TAKANEZAWA, Hikari MURAI, Tetsurou IRINO
  • Patent number: 9079376
    Abstract: Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure. A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: July 14, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomohiko Kotake, Masato Miyatake, Shunsuke Nagai, Hiroyuki Izumi, Shinji Tsuchikawa, Shin Takanezawa, Hikari Murai
  • Patent number: 9078365
    Abstract: Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: July 7, 2015
    Assignee: HITACHI CHEMICAL CO., LTD.
    Inventors: Koji Morita, Shin Takanezawa, Kazunaga Sakai, Yuusuke Kondou
  • Patent number: 8815334
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: August 26, 2014
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20140192501
    Abstract: A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100.
    Type: Application
    Filed: November 29, 2013
    Publication date: July 10, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko KOTAKE, Shunsuke NAGAI, Shintaro HASHIMOTO, Shinichiro ABE, Masato MIYATAKE, Shin TAKANEZAWA, Hikari MURAI
  • Patent number: 8735733
    Abstract: Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board. A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: May 27, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masato Miyatake, Tomohiko Kotake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai
  • Publication number: 20140000948
    Abstract: There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.
    Type: Application
    Filed: January 17, 2012
    Publication date: January 2, 2014
    Inventors: Shunsuke Nagai, Masato Miyatake, Tomohiko Kotake, Shintaro Hashimoto, Yasuo Inoue, Shin Takanezawa, Hikari Murai