Patents by Inventor Shin-Terng Chiang

Shin-Terng Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6808323
    Abstract: A passive alignment packaging structure for opto-electrical devices and optic fiber connectors provides a passive alignment packaging structure for opto-electrical devices and optic fiber connectors. The passive alignment packaging is of great benefit to automatic assembly in lowering the manufacturing cost and satisfying the requirement of a precisely aligned optical path. The invention connects the silicon substrate for installing an opto-electrical device to a leadframe by soldering. The surface tension of the melted soldering tin helps self-alignment in the horizontal direction. A guiding pin penetrates through the leadframe and the through hole of a lens support for installing a micro lens set to have vertical alignment. The opto-electrical device, the micro lens set, and the optic fiber connector are thus precisely aligned. The leadframe and the through hole on the lens support have alignment and stress relaxation designs to reduce deformation.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: October 26, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Shin-Terng Chiang, Chun-Kai Liu, Yu-Kon Chou
  • Patent number: 6700783
    Abstract: A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge portion extending upwardly; a cavity formed in-between the upper heat spreader and the lower heat spreader by engaging the first edge portion and the second edge portion together adapted for receiving an electronic device.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: March 2, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Kai Liu, Shin-Terng Chiang
  • Publication number: 20030161591
    Abstract: A passive alignment packaging structure for opto-eletrical devices and optic fiber connectors provides a passive alignment packaging structure for opto-electrical devices and optic fiber connectors. The passive alignment packaging is of great benefit to automatic assembly in lowering the manufacturing cost and satisfying the requirement of a precisely aligned optical path. The invention connects the silicon substrate for installing an opto-electrical device to a leadframe by soldering. The surface tension of the melted soldering tin helps self-alignment in the horizontal direction. A guiding pin penetrates through the leadframe and the through hole of a lens support for installing a micro lens set to have vertical alignment. The opto-electrical device, the micro lens set, and the optic fiber connector are thus precisely aligned. The leadframe and the through hole on the lens support have alignment and stress relaxation designs to reduce deformation.
    Type: Application
    Filed: February 13, 2003
    Publication date: August 28, 2003
    Inventors: Shin-Terng Chiang, Chun-Kai Liu, Yu-Kon Chou