Patents by Inventor Shin Tsumura

Shin Tsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive application method and terminal joining method
    Patent number: 8551275
    Abstract: Disclosed herein is an adhesive application method of applying adhesive to a protruding part formed on a substrate. The adhesive application method includes an adhesive preparing step of forming an adhesive layer on the surface of a plate member, an adhesive applying step of allowing the protruding part and the adhesive layer to be brought into contact with each other such that the surface of the substrate around the protruding part does not contact the adhesive layer, and a moving step of moving the substrate and the plate member relative to each other in the plane parallel with the surface of the plate member while the surface of the substrate around the protruding part is not in contact with the adhesive layer and the protruding part and the adhesive layer are in contact with each other.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: October 8, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Shin Tsumura
  • Adhesive Application Method And Terminal Joining Method
    Publication number: 20060219356
    Abstract: Disclosed herein is an adhesive application method of applying adhesive to a protruding part formed on a substrate. The adhesive application method includes an adhesive preparing step of forming an adhesive layer on the surface of a plate member, an adhesive applying step of allowing the protruding part and the adhesive layer to be brought into contact with each other such that the surface of the substrate around the protruding part does not contact the adhesive layer, and a moving step of moving the substrate and the plate member relative to each other in the plane parallel with the surface of the plate member while the surface of the substrate around the protruding part is not in contact with the adhesive layer and the protruding part and the adhesive layer are in contact with each other.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 5, 2006
    Applicant: Brother Kogyo Kabushiki Kaisha
    Inventor: Shin Tsumura