Patents by Inventor Shin-tsung CHEN

Shin-tsung CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit with antenna in package testing apparatus
    Patent number: 11119139
    Abstract: An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: September 14, 2021
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Shin-tsung Chen, Wei-cheng Wang
  • INTEGRATED CIRCUIT WITH ANTENNA IN PACKAGE TESTING APPARATUS
    Publication number: 20210011069
    Abstract: An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 14, 2021
    Inventors: Shin-tsung CHEN, Wei-cheng WANG