Abstract: [Problem] Provided is a method of processing image data capable of, at the time of measuring a wafer in a circumferential direction thereof using a surface inspection device employing a laser scattering method to create a Haze map, reducing or removing occurrence of a noise resulting from change in detection sensitivity of the device. Further, provided is a method of creating an image by using the method of processing an image data. [Solving Means] There is provided a method of processing image data, including the steps of: measuring a haze value corresponding to each position on a wafer surface by using a wafer surface inspection device; and, subjecting image data formed by the haze value corresponding to each position on the wafer surface to an image data process along a direction in which the haze value is measured, to remove a noise component.

Abstract: A method of evaluating a silicon wafer includes obtaining first surface distribution information indicating an surface distribution of photoluminescence intensity on a surface of a silicon wafer; after obtaining the first surface distribution information, subjecting the silicon wafer to a thermal oxidation treatment, and then obtaining second surface distribution information indicating an surface distribution of photoluminescence intensity on the surface of the silicon wafer; obtaining difference information for the first surface distribution information and third surface distribution information, with the third surface distribution information having been obtained by correcting the second surface distribution information with a correction coefficient of less than 1; and based on the difference information obtained, evaluating an evaluation item selected from the group consisting of absence or presence of oxygen precipitates and surface distribution of oxygen precipitates in the silicon wafer being evaluated.

Abstract: A method of evaluating a silicon wafer includes obtaining first surface distribution information indicating an surface distribution of photoluminescence intensity on a surface of a silicon wafer; after obtaining the first surface distribution information, subjecting the silicon wafer to a thermal oxidation treatment, and then obtaining second surface distribution information indicating an surface distribution of photoluminescence intensity on the surface of the silicon wafer; obtaining difference information for the first surface distribution information and third surface distribution information, with the third surface distribution information having been obtained by correcting the second surface distribution information with a correction coefficient of less than 1; and based on the difference information obtained, evaluating an evaluation item selected from the group consisting of absence or presence of oxygen precipitates and surface distribution of oxygen precipitates in the silicon wafer being evaluated.

Abstract: [Problem] Provided is a method of processing image data capable of, at the time of measuring a wafer in a circumferential direction thereof using a surface inspection device employing a laser scattering method to create a Haze map, reducing or removing occurrence of a noise resulting from change in detection sensitivity of the device. Further, provided is a method of creating an image by using the method of processing an image data. [Solving Means] There is provided a method of processing image data, including the steps of: measuring a haze value corresponding to each position on a wafer surface by using a wafer surface inspection device; and, subjecting image data formed by the haze value corresponding to each position on the wafer surface to an image data process along a direction in which the haze value is measured, to remove a noise component.