Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: A method for making a semiconductor structure includes: providing a substrate with a contact feature thereon; forming a dielectric layer on the substrate; etching the dielectric layer to form an interconnect opening exposing the contact feature; forming a metal layer on the dielectric layer and outside of the contact feature; and forming a graphene conductive structure on the metal layer, the graphene conductive structure filling the interconnect opening, being electrically connected to the contact feature, and having at least one graphene layer that extends in a direction substantially perpendicular to the substrate.

Abstract: A method of making a semiconductor device includes forming a first polysilicon structure over a first portion of a substrate. The method further includes forming a first spacer on a sidewall of the first polysilicon structure, wherein the first spacer has a concave corner region between an upper portion and a lower portion. The method further includes forming a protective layer covering an entirety of the first spacer and the first polysilicon structure, wherein the protective layer has a first thickness over the concave corner region and a second thickness over the first polysilicon structure, and a difference between the first thickness and the second thickness is at most 10% of the second thickness.

Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.

Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A computer system, remote control monitoring system, and remote control monitoring method are provided to instantly provide the local display screen of the local computer to the remote computer for remote real-time display. The remote control monitoring system is arranged in the local computer and has a signal receiver and a remote controller. The signal receiver receives the video signal from the processor, executes the signal transforming process to generate the video signal in different standards. The remote controller executes a network compressing process on the transformed video signal to generate the network transportable video data, and transmits the data to the remote computer for displaying the corresponding remote display screen on the remote computer. The present disclosure enables the implementing of the out-of-band remote displaying.

Abstract: A computer system, remote control monitoring system, and remote control monitoring method are provided to instantly provide the local display screen of the local computer to the remote computer for remote real-time display. The remote control monitoring system is arranged in the local computer and has a signal receiver and a remote controller. The signal receiver receives the video signal from the processor, executes the signal transforming process to generate the video signal in different standards. The remote controller executes a network compressing process on the transformed video signal to generate the network transportable video data, and transmits the data to the remote computer for displaying the corresponding remote display screen on the remote computer. The present disclosure enables the implementing of the out-of-band remote displaying.

Abstract: A method for playing audio files using portable electronic devices, comprising: providing a portable electronic device and a processor wirelessly communicating with the portable electronic device; building a list of audio files to be played; downloading the audio files according to the list and storing the audio files in the processor; selecting audio files in the list by the portable electronic device; and wirelessly sending the selected audio files to the portable electronic device to play.