Patents by Inventor Shin-Yi Chou

Shin-Yi Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming an intermetal dielectric layer
    Patent number: 6916736
    Abstract: A method of forming an intermetal dielectric (IMD) layer. At least one metal wire is formed on a substrate. A filling oxide layer is formed on the substrate and the metal wire. The surface of the filling oxide layer is smoothed. A first silicon-rich oxide layer is formed on the filling oxide layer, where the refractive index (RI) of the first silicon-rich oxide layer is 1.6˜1.64. A second silicon-rich oxide layer is formed on the first silicon-rich oxide layer, where the refractive index of the second silicon-rich oxide layer is 1.49˜1.55. According to the present method, the diffusion of mobile hydrogen ions is blocked by manufacture with dual silicon-rich oxide layers.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: July 12, 2005
    Assignee: Macronix International Co., Ltd.
    Inventors: Fu-Hsiang Hsu, U-Way Tseng, Hung-Yu Chiu, Shih-Liang Chou, Shin-Yi Chou
  • Method of forming an intermetal dielectric layer
    Publication number: 20030181030
    Abstract: A method of forming an intermetal dielectric (IMD) layer. At least one metal wire is formed on a substrate. A filling oxide layer is formed on the substrate and the metal wire. The surface of the filling oxide layer is smoothed. A first silicon-rich oxide layer is formed on the filling oxide layer, where the refractive index (RI) of the first silicon-rich oxide layer is 1.6˜1.64. A second silicon-rich oxide layer is formed on the first silicon-rich oxide layer, where the refractive index of the second silicon-rich oxide layer is 1.49˜1.55. According to the present method, the diffusion of mobile hydrogen ions is blocked by manufacture with dual silicon-rich oxide layers.
    Type: Application
    Filed: March 19, 2003
    Publication date: September 25, 2003
    Inventors: Fu-Hsiang Hsu, U-Way Tseng, Hung-Yu Chiu, Shih-Liang Chou, Shin-Yi Chou