Patents by Inventor Shin-Yi Wang

Shin-Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170153047
    Abstract: A temperature informing apparatus for a user to actually experience a target temperature includes a thermoelectric conversion module, a temperature sensor, a first current path, a second current path, a charging/discharging element and a micro-processor. The thermoelectric conversion module is disposed between an upper cover and a lower cover of a wearable device. The temperature sensor senses a temperature of the upper cover and the lower cover. The micro-processor compares the temperature with the target temperature to get a temperature difference to calculate a corresponding current and controls the charging/discharging element to transfer the corresponding current to the thermoelectric conversion module to heat up or cool down the upper cover or the lower cover.
    Type: Application
    Filed: May 3, 2016
    Publication date: June 1, 2017
    Inventors: Meng-Lung CHIANG, Shin-Yi WANG
  • Patent number: 8644023
    Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: February 4, 2014
    Assignee: Inventec Corporation
    Inventors: Shin-Yi Wang, Chun-Lung Lin
  • Publication number: 20120320526
    Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.
    Type: Application
    Filed: August 5, 2011
    Publication date: December 20, 2012
    Applicant: INVENTEC CORPORATION
    Inventors: Shin-Yi Wang, Chun-Lung Lin