Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.

Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.

Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.

Abstract: A wavelength-converting material and an application thereof are provided. The wavelength-converting material includes an all-inorganic perovskite quantum dot having a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.

Abstract: A quantum dot composite material and a manufacturing method and an application thereof are provided. The quantum dot composite material includes an all-inorganic perovskite quantum dot and a modification protection on a surface of the all-inorganic perovskite quantum dot. The all-inorganic perovskite quantum dot has a chemical formula of CsPb(ClaBr1-a-bIb)3, wherein 0?a?1, 0?b?1.

Abstract: An embodiment of the present disclosure discloses a phosphor material and a manufacturing method thereof. The general composition of the phosphor material is A2-xMO4:Eux, wherein A includes a single element or at least two elements selected from the group consisting of Ca, Sr, and Ba, M is Si, Ge or combination thereof, wherein x is greater than 0.01 and 2-x>0. The phosphor material can be excited by a first excitation wavelength and emit a first emission spectrum and, excited by a second excitation wavelength and emit a second emission spectrum. The first excitation wavelength is different from the second excitation wavelength, and the first emission spectrum is different from the second emission spectrum.

Abstract: An EMI shielding assembly having a surface plate formed as a single unit with one or more wall components is disclosed. The surface plate of the shielding assembly is divided into different zones by the wall component. When the shielding assembly is mounted onto a circuit board, not only the electromagnetic waves generated by the electronic components installed within the area of different zones are prevented by the shielding of the surface plate from leaking outside, but also the aforementioned waves are isolated by the wall components that cross components EMI effect is prevented from happening. Therefore, the goal that not only prevent the electromagnetic wave generated by the electronic components on the circuit board from leaking outside, but also prevent the cross components EMI effects between the different electronic components installed on the same circuit board by a single unit shielding assembly is achieved.

Abstract: A dual slot card receiving apparatus for a mobile communication device includes a circuit board, a first connector, a second connector, and an arranging card device. The first connector is provided on the circuit board and electrically connected with the circuit board. The second connector is coupled with the circuit board and corresponds to the first connector, thereby forming a space between the second connector and the circuit board. The card arranging device is put into the space and has a concave portion in either side to received a first card and a second card. The first card is coupled to the circuit board through the first connector, and the second card is coupled to the circuit board through the second connector.