Abstract: A hinge assembly for an electronic device includes a joint assembly including joint components hinged one by one. Each joint component includes a first plate, a second plate, and a link component disposed between the first and second plates. Each of the first and second plates has two first slots diametrically extending in a first direction. The first plate has a second slot disposed between the two first slots and diametrically extending in a second direction different from the first direction. The second plate has a third slot disposed between the two first slots and diametrically extending in a third direction mirror-symmetrical to the second direction with respect to the first direction. The link component has an engaging hole and a guide portion. The engaging hole is corresponding to one of the first slots of each of the first and second plates, and the guide portion is formed on a surface of the link component and movable within the second or third slot.

Abstract: A hinge assembly for an electronic device includes a joint assembly including joint components hinged one by one. Each joint component includes a first plate, a second plate, and a link component disposed between the first and second plates. Each of the first and second plates has two first slots diametrically extending in a first direction. The first plate has a second slot disposed between the two first slots and diametrically extending in a second direction different from the first direction. The second plate has a third slot disposed between the two first slots and diametrically extending in a third direction mirror-symmetrical to the second direction with respect to the first direction. The link component has an engaging hole and a guide portion. The engaging hole is corresponding to one of the first slots of each of the first and second plates, and the guide portion is formed on a surface of the link component and movable within the second or third slot.