Patents by Inventor Shing Bo Peh

Shing Bo Peh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109025
    Abstract: Disclosed herein is a composite material comprising: a plurality of water-stable metal-organic frameworks, each having a plurality of porous cavities; and a temperature-sensitive polymeric material in the form of polymer chains, wherein the polymer chains of the temperature-sensitive polymeric material are formed at least partly within the porous cavities of the plurality of water-stable metal-organic frameworks. Also disclosed herein is the use of said composite material for adsorption and release of water.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 4, 2024
    Inventors: Dan Zhao, Avishek Karmakar, Shing Bo Peh
  • Patent number: 11896951
    Abstract: Disclosed herein is a metal organic framework (MOF) having a UTSA-16 structure, where the composition comprises: from 0 to 80 mol % of the total metal in the MOF is a first metal selected from one or more of the group consisting of Cr, Mn, Fe, Ni, Cu, and Co; and from 20 to 100 mol % of the total metal in the MOF is a second metal selected from one or more of the group consisting of Cd, Mn, and Zn.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 13, 2024
    Assignee: National University of Singapore
    Inventors: Dan Zhao, Shing Bo Peh, Avishek Karmakar
  • Publication number: 20230191365
    Abstract: Disclosed herein is a metal organic framework (MOF) having a UTSA-16 structure, where the composition comprises: from 0 to 80 mol % of the total metal in the MOF is a first metal selected from one or more of the group consisting of Cr, Mn, Fe, Ni, Cu, and Co; and from 20 to 100 mol % of the total metal in the MOF is a second metal selected from one or more of the group consisting of Cd, Mn, and Zn.
    Type: Application
    Filed: April 19, 2021
    Publication date: June 22, 2023
    Inventors: Dan Zhao, Shing Bo Peh, Avishek Karmakar