Abstract: A catalytic apparatus is used for a motorcycle with an engine. The catalytic apparatus includes an engine exhaust manifold, a silencer, a front exhaust pipe positioned between the engine exhaust manifold and the silencer, a front supply pipe connected to the engine exhaust manifold and configured for supplying secondary air, and at least one catalytic converter positioned in the silencer. A catalyst is coated on an inner wall of the front exhaust pipe. The catalyst receives the secondary air supplied by the front supply pipe to clean engine exhaust gases. Particularly, when the motorcycle is started in a cold state, the present catalytic apparatus can enhance the temperature of the engine exhaust gases, and the at least one catalytic converter can be accelerated to reach its operating temperature.

Abstract: A exhaust gas cleaning purifier used in an engine of a locomotive, which is arranged between an exhaust pipe of the engine and a silencer connecting to the exhaust pipe, includes a front supply pipe and a back supply pipe configured for supplying secondary air, at least one front catalyst converter for making an oxidation reaction and at least one middle catalyst converter for making an reduction reaction, and at least one back catalyst converter arranged after the silencer and the back supply pipe. The front supply pipe connects with the exhaust terminal of the engine, and the back supply pipe connects with the silencer. The at least one front catalyst converter and the at least one middle catalyst converter are arranged in the silencer and arranged between the front and back supply pipes. A dissipating-heat distance is defined between the front catalyst converter and the middle catalyst converter.

Abstract: A method for forming an improved etching hardmask oxide layer in a polysilicon etching process including providing a planarized semiconductor wafer process surface including adjacent first exposed polysilicon portions and exposed oxide portions; selectively etching through a thickness portion of the exposed oxide portions; thermally growing an oxide hardmask layer over the exposed polysilicon portions to form oxide hardmask portions; exposing second exposed polysilicon portions adjacent at least one oxide hardmask portion; and, etching through a thickness portion of the second exposed polysilicon portions.

Abstract: A non-volatile memory is described. A substrate comprising a stacked layer is provided. A sacrificial layer is deposited and patterned to form a first opening. A first spacer is formed on sidewalls of the first opening, and the stacked layer is etched using the first spacer as a first mask to form a second opening. An isolation layer is formed in a portion of the first and the second openings, and a conductive filling layer is formed thereon. The stacked layer is etched using a portion of the conductive filling layer as a second mask.

Abstract: A light emitting diode reflector molding process, and a construction thereof includes preparation of a first and a second green sheet structures, the first green sheet structure being provided with a first pattern; the second green sheet structure being placed on top of the first green sheet structure; a metallic layer being coated on the second green sheet structure, the second green sheet structure being molded along the opening pattern of and covering upon the first green sheet for the metallic layer to become the wall of the reflector opening.

Abstract: A light emitting diode reflector molding process, and a construction thereof includes preparation of a first and a second green sheet structures respectively provided with a first and a second open patterns with the porosity of the second open pattern smaller than that of the first open pattern; the second green sheet structure being placed on top of the first green sheet structure to such that both opening patterns being overlapped to each; a metallic layer being coated on the second green sheet structure, the second green sheet structure being molded along the opening pattern of and covering upon the first green sheet for the metallic layer to become the wall of the reflector opening.

Abstract: An exhaust gas sensor comprises a planar sensing element, which comprises a ceramic heater, a solid electrolyte electrochemical cell, and a protection layer for the sensing electrode and electrode leads. The protection layer comprises built-in arrays of porous vias.

Abstract: A memory device and the method for manufacturing same is disclosed. The device comprises a first oxide layer on top of a substrate, a floating gate layer on top of the first oxide layer, a second oxide layer over the floating gate layer, wherein the second oxide layer and the floating gate layer have a first opening and a second opening respectively, and wherein the width of second opening is bigger than the width of the narrowest region of the first opening so that the floating gate layer is pulled back horizontally underneath the second oxide layer. A source region is in the substrate underneath the first oxide layer, and a third oxide layer fills in the first and second openings conforming to the contour thereof, wherein the third oxide has a third opening to reach a portion of the source region. Further, a control gate material fills in the third opening.

Abstract: Each of an elevated diode sensor optoelectronic product and a method for fabricating the elevated diode sensor optoelectronic product employs a sidewall passivation dielectric layer passivating a sidewall of a patterned conductor layer which serves as a bottom electrode for an elevated diode within the elevated diode sensor optoelectronic product. The sidewall passivation dielectric layer eliminates contact between the patterned conductor layer and an intrinsic diode material layer within the elevated diode, thus providing enhanced performance of the elevated diode sensor optoelectronic product.

Abstract: A split gate flash memory cell structure is disclosed for prevention of reverse tunneling. A gate insulator layer is formed over a semiconductor surface and a floating gate is disposed over the gate insulator layer. A floating gate insulator layer is disposed over the floating gate and sidewall insulator spacers are disposed along bottom portions of the floating gate sidewall adjacent to said gate insulator layer. The sidewall insulator spacers are formed from a spacer insulator layer that had been deposited in a manner that constitutes a minimal expenditure of an available thermal budget and etching processes used in fashioning the sidewall insulator spacers etch the spacer insulator layer faster than the gate insulator layer and the floating gate insulator layer. An intergate insulator layer is disposed over exposed portions of the gate insulator layer, the floating gate, the floating gate insulator layer and the sidewall insulator spacers.

Abstract: A non-volatile memory is described. A substrate comprising a stacked layer is provided. A sacrificial layer is deposited and patterned to form a first opening. A first spacer is formed on sidewalls of the first opening, and the stacked layer is etched using the first spacer as a first mask to form a second opening. An isolation layer is formed in a portion of the first and the second openings, and a conductive filling layer is formed thereon. The stacked layer is etched using a portion of the conductive filling layer as a second mask.

Abstract: A split gate flash memory cell structure is disclosed for prevention of reverse tunneling. A gate insulator layer is formed over a semiconductor surface and a floating gate is disposed over the gate insulator layer. A floating gate insulator layer is disposed over the floating gate and sidewall insulator spacers are disposed along bottom portions of the floating gate sidewall adjacent to said gate insulator layer. The sidewall insulator spacers are formed from a spacer insulator layer that had been deposited in a manner that constitutes a minimal expenditure of an available thermal budget and etching processes used in fashioning the sidewall insulator spacers etch the spacer insulator layer faster than the gate insulator layer and the floating gate insulator layer. An intergate insulator layer is disposed over exposed portions of the gate insulator layer, the floating gate, the floating gate insulator layer and the sidewall insulator spacers.

Abstract: A memory device and the method for manufacturing same is disclosed. The device comprises a first oxide layer on top of a substrate, a floating gate layer on top of the first oxide layer, a second oxide layer over the floating gate layer, wherein the second oxide layer and the floating gate layer have a first opening and a second opening respectively, and wherein the width of second opening is bigger than the width of the narrowest region of the first opening so that the floating gate layer is pulled back horizontally underneath the second oxide layer. A source region is in the substrate underneath the first oxide layer, and a third oxide layer fills in the first and second openings conforming to the contour thereof, wherein the third oxide has a third opening to reach a portion of the source region. Further, a control gate material fills in the third opening.

Abstract: A method for forming an improved etching hardmask oxide layer in a polysilicon etching process including providing a planarized semiconductor wafer process surface including adjacent first exposed polysilicon portions and exposed oxide portions; selectively etching through a thickness portion of the exposed oxide portions; thermally growing an oxide hardmask layer over the exposed polysilicon portions to form oxide hardmask portions; exposing second exposed polysilicon portions adjacent at least one oxide hardmask portion; and, etching through a thickness portion of the second exposed polysilicon portions.

Abstract: A memory device and the method for manufacturing the same is disclosed. The device includes a first oxide layer on top of a substrate, a floating gate layer on top of the first oxide layer, and a second oxide layer over the floating gate layer. The second oxide layer and the floating gate layer have a first opening and a second opening respectively wherein the width of second opening is bigger than the width of the narrowest region of the first opening so that the floating gate layer is pulled back horizontally underneath the second oxide layer. A source region is in the substrate underneath the first oxide layer, and a third oxide layer fills in the first and second openings conforming to the contour thereof. The third oxide has a third opening to reach a portion of the source region. Further, a control gate material fills in the third opening.

Abstract: Each of an elevated diode sensor optoelectronic product and a method for fabricating the elevated diode sensor optoelectronic product employs a sidewall passivation dielectric layer passivating a sidewall of a patterned conductor layer which serves as a bottom electrode for an elevated diode within the elevated diode sensor optoelectronic product. The sidewall passivation dielectric layer eliminates contact between the patterned conductor layer and an intrinsic diode material layer within the elevated diode, thus providing enhanced performance of the elevated diode sensor optoelectronic product.

Abstract: A method for forming an improved etching hardmask oxide layer in a polysilicon etching process including providing a planarized semiconductor wafer process surface including adjacent first exposed polysilicon portions and exposed oxide portions; selectively etching through a thickness portion of the exposed oxide portions; thermally growing an oxide hardmask layer over the exposed polysilicon portions to form oxide hardmask portions; exposing second exposed polysilicon portions adjacent at least one oxide hardmask portion; and, etching through a thickness portion of the second exposed polysilicon portions.

Abstract: A memory device and the method for manufacturing the same is disclosed. The device includes a first oxide layer on top of a substrate, a floating gate layer on top of the first oxide layer, and a second oxide layer over the floating gate layer. The second oxide layer and the floating gate layer have a first opening and a second opening respectively wherein the width of second opening is bigger than the width of the narrowest region of the first opening so that the floating gate layer is pulled back horizontally underneath the second oxide layer. A source region is in the substrate underneath the first oxide layer, and a third oxide layer fills in the first and second openings conforming to the contour thereof. The third oxide has a third opening to reach a portion of the source region. Further, a control gate material fills in the third opening.

Abstract: A reversible ratchet wrench includes a wrench body having a head portion that has a hole and a chamber communicated with the hole. A ratchet wheel is rotatably mounted in the hole of the wrench body. A pawl is moveably received in the chamber of the wrench body and meshed with the ratchet wheel. An annular cover is rotatably mounted on the head portion of the wrench body for preventing the ratchet wheel from escaping out of the hole of the wrench body. The annular cover has a driving member contactable to the pawl for driving the pawl to move to a position where the ratchet wheel can be forced to turn clockwise or counterclockwise.

Abstract: A method for forming an improved etching hardmask oxide layer in a polysilicon etching process including providing a planarized semiconductor wafer process surface including adjacent first exposed polysilicon portions and exposed oxide portions; selectively etching through a thickness portion of the exposed oxide portions; thermally growing an oxide hardmask layer over the exposed polysilicon portions to form oxide hardmask portions; exposing second exposed polysilicon portions adjacent at least one oxide hardmask portion; and, etching through a thickness portion of the second exposed polysilicon portions.