Patents by Inventor Shing Dick Pang Tak

Shing Dick Pang Tak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED back end assembly and method of manufacturing
    Patent number: 9748460
    Abstract: An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: August 29, 2017
    Assignee: Flextronics AP, LLC
    Inventors: Samuel Tam, Murad Kurwa, Shing Dick Pang Tak
  • LED BACK END ASSEMBLY AND METHOD OF MANUFACTURING
    Publication number: 20140239342
    Abstract: An LED device and method of manufacture including separately coupling a thin flexible interposer and an LED die to a heat sink structure and then electrically coupling the interposer and the LED die together with a wirebond. A specifically shaped perimeter of an aperture within the interposer negates the need for a cavity or alignment markings within the heat sink structure by limiting the orientation in which the die fits within the aperture. Alternatively, an LED device and method of manufacture include coupling a rigid circuit board to an LED die such that electrical contacts of the die are electrically coupled with electrical input/output terminals of the circuit board. This die/board unit is then able to be coupled to a heat sink structure to form a portion of the device.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 28, 2014
    Applicant: Flextronics AP, LLC
    Inventors: Samuel Tam, Murad Kurwa, Shing Dick Pang Tak