Patents by Inventor Shing-Fei CHEN

Shing-Fei CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240411189
    Abstract: A circuit substrate with multiple voltage input ports. A substrate has an active area and a peripheral area surrounding the active area. A signal transmitting structure is disposed on the active area and the peripheral area. A conductive structure is disposed on the peripheral area, and is electrically connected to the signal transmitting structure. The conductive structure includes first conductive wiring, second conductive wiring, and converging wiring. At the first end of the converging wiring, the converging wiring receives a first signal from the first conductive wiring, and receives a second signal from the second conductive wiring. The converging wiring outputs a third signal to the signal transmitting structure through its second end. The third signal is a common voltage.
    Type: Application
    Filed: May 2, 2024
    Publication date: December 12, 2024
    Inventors: Mei-Hsiu PAN, Chung-Wen YEN, Shing-Fei CHEN