Patents by Inventor Shing-Fong WU

Shing-Fong WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for treating fluid
    Patent number: 9789448
    Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: October 17, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Fong Wu, Yung-Ti Hung, Shih-Pao Chien, Yen-Chen Chen
  • PROCESS AND SYSTEM FOR TREATING FLUID
    Publication number: 20150214035
    Abstract: Embodiments of a process for treating a fluid are provided. The process for treating a fluid includes supplying a first fluid to a circulating chamber and introducing a first gas to the first fluid. A portion of the first gas is dissolved in the first fluid and a portion of the first gas is held in a head space portion of the circulating chamber. The process further includes mixing a portion of the first fluid drawn out from the circulating chamber and a portion of the first gas drawn out from the head space portion to form a mixture. The process further includes spraying the mixture back into the circulating chamber by a two-fluid nozzle. In addition, the first gas is further dissolved into the first fluid to form a high conductivity fluid. The process further includes draining the high conductivity fluid from the circulating chamber.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 30, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shing-Fong WU, Yung-Ti HUNG, Shih-Pao CHIEN, Yen-Chen CHEN