Patents by Inventor Shing-Kuei LAI

Shing-Kuei LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for semiconductor wafer alignment
    Patent number: 9952520
    Abstract: A method for aligning a semiconductor wafer is provided. The method includes providing the semiconductor wafer having two alignment marks formed on an active region or on an edge region of the semiconductor wafer. An included angle that is formed between the two alignment marks in a circumferential direction of the semiconductor wafer is between about 12 degrees and about 36 degrees. The method further includes receiving the detection signal reflected from at least one of the first alignment mark and the second alignment mark. The method also includes determining a parameter by a control system based on the received detection signal and moving the semiconductor wafer according to the parameter.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: April 24, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shing-Kuei Lai, Wei-Yueh Tseng, Hsiao-Yi Wang, De-Fang Huang
  • METHOD FOR SEMICONDUCTOR WAFER ALIGNMENT
    Publication number: 20170192367
    Abstract: A method for aligning a semiconductor wafer is provided. The method includes providing the semiconductor wafer having two alignment marks formed on an active region or on an edge region of the semiconductor wafer. An included angle that is formed between the two alignment marks in a circumferential direction of the semiconductor wafer is between about 12 degrees and about 36 degrees. The method further includes receiving the detection signal reflected from at least one of the first alignment mark and the second alignment mark. The method also includes determining a parameter by a control system based on the received detection signal and moving the semiconductor wafer according to the parameter.
    Type: Application
    Filed: March 16, 2017
    Publication date: July 6, 2017
    Inventors: Shing-Kuei LAI, Wei-Yueh TSENG, Hsiao-Yi WANG, De-Fang HUANG
  • Method for semiconductor wafer alignment
    Patent number: 9601436
    Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a base layer having an active region and an edge region. A number of semiconductor devices is formed on the active region. The semiconductor wafer also includes a wafer identification. The wafer identification is formed on the edge region and used for identifying the semiconductor wafer. The semiconductor wafer further includes an alignment mark. The alignment mark is formed on the edge region and is used for performing an alignment process of the semiconductor wafer.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: March 21, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shing-Kuei Lai, Wei-Yueh Tseng, Hsiao-Yi Wang, De-Fang Huang
  • METHOD FOR SEMICONDUCTOR WAFER ALIGNMENT
    Publication number: 20150357287
    Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a base layer having an active region and an edge region. A number of semiconductor devices is formed on the active region. The semiconductor wafer also includes a wafer identification. The wafer identification is formed on the edge region and used for identifying the semiconductor wafer. The semiconductor wafer further includes an alignment mark. The alignment mark is formed on the edge region and is used for performing an alignment process of the semiconductor wafer.
    Type: Application
    Filed: June 6, 2014
    Publication date: December 10, 2015
    Inventors: Shing-Kuei LAI, Wei-Yueh TSENG, Hsiao-Yi WANG, De-Fang HUANG