Patents by Inventor Shing Tak Li

Shing Tak Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to form an inductive component
    Patent number: 12080472
    Abstract: A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: September 3, 2024
    Assignee: CYNTEC CO., LTD.
    Inventors: Pei-I Wei, Cheng-Hao Chang, Shing Tak Li
  • METHOD TO FORM AN INDUCTIVE COMPONENT
    Publication number: 20240006116
    Abstract: A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.
    Type: Application
    Filed: September 6, 2023
    Publication date: January 4, 2024
    Inventors: Pei-I Wei, Cheng-Hao Chang, Shing Tak Li
  • Integrally-formed inductor and a fabricatin method thereof
    Patent number: 11783992
    Abstract: An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: October 10, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Pei-I Wei, Cheng-Hao Chang, Shing Tak Li
  • COUPLED INDUCTOR AND THE METHOD TO MAKE THE SAME
    Publication number: 20220351894
    Abstract: A coupled inductor has two coils made by film or a lithography processes, wherein a first coil is disposed on a top surface of a magnetic sheet and a second coil is disposed on the bottom surface of the magnetic sheet, for controlling the variations of the alignments of the two coils in a smaller range.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 3, 2022
    Inventors: Cheng-Hao Chang, Shing Tak Li
  • INTEGRALLY-FORMED INDUCTOR AND A FABRICATIN METHOD THEREOF
    Publication number: 20210074470
    Abstract: An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.
    Type: Application
    Filed: July 23, 2020
    Publication date: March 11, 2021
    Inventors: Pei-I Wei, Cheng-Hao Chang, Shing Tak Li