Patents by Inventor Shing-Tza Liou

Shing-Tza Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8453324
    Abstract: A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: June 4, 2013
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Rui-Wu Liu, Yung-Wei Lai, Shing-Tza Liou
  • Patent number: 8205330
    Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: June 26, 2012
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Qi Zhang, Yung-Wei Lai, Shing-Tza Liou
  • Patent number: 8164000
    Abstract: A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: April 24, 2012
    Assignee: Zhen Ding Technology Co., Ltd.
    Inventors: Tso-Hung Yeh, Hung-Yi Chang, Shing-Tza Liou
  • Publication number: 20120066903
    Abstract: A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.
    Type: Application
    Filed: November 29, 2011
    Publication date: March 22, 2012
    Applicants: ZHEN DING TECHNOLOGY CO., LTD., FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
    Inventors: RUI-WU LIU, YUNG-WEI LAI, SHING-TZA LIOU
  • Patent number: 8071887
    Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: December 6, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Shing-Tza Liou, Yao-Wen Bai, Cheng-Hsien Lin
  • Patent number: 8052881
    Abstract: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: November 8, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.
    Inventors: Yun-Li Zhu, Yung-Wei Lai, Shing-Tza Liou
  • Patent number: 7998332
    Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: August 16, 2011
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.
    Inventors: Shing-Tza Liou, Yao-Wen Bai, Rui Zhang, Qiu-Yue Zhang
  • Patent number: 7985482
    Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: July 26, 2011
    Assignee: Foxconn Advanced Technology Inc.
    Inventors: Yung-Wei Lai, Cheng-Wei Kuo, Shing-Tza Liou
  • Patent number: 7728232
    Abstract: An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: June 1, 2010
    Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.
    Inventors: Feng-Yan Huang, Shing-Tza Liou
  • Publication number: 20090246357
    Abstract: A method of forming a circuit on a circuit board includes the steps of: forming a first circuit pattern made of a nano-scale metal oxide material on a surface of an insulating substrate; reducing the nano-scale metal oxide material into a nano-scale deoxidized metal material, thus obtaining a second circuit pattern; and forming an electrically conductive metal layer on the second circuit pattern.
    Type: Application
    Filed: September 23, 2008
    Publication date: October 1, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: Shing-Tza Liou, Qiu-Yur Zhang, Cheng-Hsien Lin
  • Publication number: 20090242246
    Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
    Type: Application
    Filed: October 17, 2008
    Publication date: October 1, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: SHING-TZA LIOU, YAO-WEN BAI, CHENG-HSIEN LIN
  • Publication number: 20090217520
    Abstract: In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.
    Type: Application
    Filed: November 7, 2008
    Publication date: September 3, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: FENG-YAN HUANG, YUNG-WEI LAI, SHING-TZA LIOU
  • Publication number: 20090205855
    Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.
    Type: Application
    Filed: June 23, 2008
    Publication date: August 20, 2009
    Applicant: FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YUNG-WEI LAI, CHENG-WEI KUO, SHING-TZA LIOU
  • Publication number: 20090178276
    Abstract: A method for forming circuit in making a printed circuit board includes the following steps. A patterned photoresist layer is formed on a surface of an insulating substrate such that a first portion of the surface of the insulating substrate is exposed and a second portion of the surface of the insulating substrate is covered by the patterned photoresist layer. An electrically conductive layer is deposited on the first portion of the surface of the insulating substrate so as to obtain a circuit formed on the surface of the insulating substrate. The patterned photoresist layer is removed from the surface second portion of the surface of the insulating substrate.
    Type: Application
    Filed: August 1, 2008
    Publication date: July 16, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YUNG-WEI LAI, FENG-YAN HUANG, SHING-TZA LIOU
  • Publication number: 20090176080
    Abstract: An exemplary stiffener includes at least one polyethylene naphthalate layer.
    Type: Application
    Filed: June 17, 2008
    Publication date: July 9, 2009
    Applicant: FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: Yung-Wei Lai, Cheng-Wei Kuo, Shing-Tza Liou
  • Publication number: 20090166063
    Abstract: An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer.
    Type: Application
    Filed: June 23, 2008
    Publication date: July 2, 2009
    Applicant: FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YUNG-WEI LAI, CHENG-WEI KUO, SHING-TZA LIOU
  • Publication number: 20090159452
    Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
    Type: Application
    Filed: June 30, 2008
    Publication date: June 25, 2009
    Applicants: FuKui Precision Component (Shenzen) Co., Ltd., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: SHING-TZA LIOU, YAO-WEN BAI, RUI ZHANG, QIU-YUE ZHANG
  • Publication number: 20090159317
    Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
    Type: Application
    Filed: June 9, 2008
    Publication date: June 25, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: QI ZHANG, YUNG-WEI LAI, SHING-TZA LIOU
  • Publication number: 20090159559
    Abstract: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board.
    Type: Application
    Filed: June 30, 2008
    Publication date: June 25, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: YUN-LI ZHU, YUNG-WEI LAI, SHING-TZA LIOU
  • Publication number: 20090120671
    Abstract: A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.
    Type: Application
    Filed: July 10, 2008
    Publication date: May 14, 2009
    Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.
    Inventors: Rui-Wu Liu, Yung-Wei Lai, Shing-Tza Liou