Patents by Inventor Shing-Yaw Hsu

Shing-Yaw Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat resistant modified bismaleimide adhesive composition
    Patent number: 5268432
    Abstract: A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.
    Type: Grant
    Filed: June 16, 1992
    Date of Patent: December 7, 1993
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Pin Pan, Tsung-Hsiung Wang, Shing-Yaw Hsu, Tzong-Ming Lee, Syh-Ming Ho