Patents by Inventor Shingetsu Yamada
Shingetsu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8742432Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.Type: GrantFiled: December 2, 2011Date of Patent: June 3, 2014Assignee: Mitsubishi Chemical CorporationInventors: Yoshihito Sato, Nobuhiro Arai, Jun Matsui, Shingetsu Yamada, Shuuji Suzuki
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Publication number: 20120138990Abstract: The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.Type: ApplicationFiled: December 2, 2011Publication date: June 7, 2012Applicant: MITSUBISHI CHEMICAL CORPORATIONInventors: Yoshihito SATO, Nobuhiro Arai, Jun Matsui, Shingetsu Yamada, Shuuji Suzuki
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Patent number: 8169129Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.Type: GrantFiled: November 28, 2008Date of Patent: May 1, 2012Assignee: Mitsubishi Plastics, Inc.Inventors: Jun Matsui, Shingetsu Yamada, Shuuji Suzuki
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Patent number: 8044304Abstract: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board 3 including a film-, thin plate-, or sheet-like insulating substrate 21 made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more.Type: GrantFiled: January 24, 2006Date of Patent: October 25, 2011Assignee: Mitsubishi Plastics, Inc.Inventor: Shingetsu Yamada
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Publication number: 20110042124Abstract: The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.Type: ApplicationFiled: December 3, 2008Publication date: February 24, 2011Applicant: Mitsubishi Plastics, Inc.Inventors: Jun Matsui, Shingetsu Yamada
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Publication number: 20100301725Abstract: The present invention provides a white film comprising a thermoplastic resin composition containing 25-100 parts by mass of an inorganic filler based on 100 parts by mass of a thermoplastic resin, wherein the average reflectance at a wavelength of 400-800 nm is 70% or more, the average linear expansion coefficient in the machine direction and the transverse direction is 35×10?6/° C. or less, and the decreasing rate in reflectance at a wavelength of 470 nm after thermal treatment at 200° C. for 4 hours is 10% or less; and the invention provides a metal laminated body. These exhibit high thermal resistance, high reflectance within visual light range, and small decrease in reflectance under a high heat load environment, but also be applicable for a large sized printed circuit boards for mounting LEDs.Type: ApplicationFiled: November 28, 2008Publication date: December 2, 2010Inventors: Jun Matsui, Shingetsu Yamada, Shuuji Suzuki
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Publication number: 20090020319Abstract: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board 3 including a film-, thin plate-, or sheet-like insulating substrate 21 made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260° C. or more.Type: ApplicationFiled: January 24, 2006Publication date: January 22, 2009Inventor: Shingetsu Yamada
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Publication number: 20080116611Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring. can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: ApplicationFiled: November 20, 2007Publication date: May 22, 2008Applicants: Sony Corporation, Mitsubishi Plastics, Inc.Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Patent number: 7334324Abstract: A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C. and an amorphous polyetherimide resin as the primary constituents, a metallic foil is embedded within the grooves so that the surface of the foil protrudes to the surface of the insulating substrate, and a conductive material formed by curing a conductive paste is used for filling the via holes.Type: GrantFiled: August 24, 2004Date of Patent: February 26, 2008Assignees: Sony Corporation, Mitsubishi Plastics, Inc.Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Patent number: 7022399Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: GrantFiled: February 3, 2003Date of Patent: April 4, 2006Assignees: Sony Corporation, Mitsubishi Plastics, Inc.Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Publication number: 20050025944Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: ApplicationFiled: August 24, 2004Publication date: February 3, 2005Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Patent number: 6824884Abstract: A heat resistant resin composition comprising 70 to 30 wt % of a crystalline polyarylketone resin having a peak crystalline melting temperature of 260° C. or higher and 30 to 70 wt % of a noncrystalline polyetherimide resin, wherein said composition has at least 2 peaks of loss tangent (tan &dgr;) between 140° C. and 250° C., determined by dynamic mechanical measurement.Type: GrantFiled: February 5, 2003Date of Patent: November 30, 2004Assignee: Mitsubishi Plastics, Inc.Inventors: Kouichirou Taniguchi, Shingetsu Yamada
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Patent number: 6797367Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: GrantFiled: February 3, 2003Date of Patent: September 28, 2004Assignees: Sony Corporation, Mitsubishi Plastics, Inc.Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Publication number: 20040096678Abstract: A film of a resin composition comprising total 100 parts by weight of a crystalline polyarylketone resin (A) and a noncrystalline polyetherimide resin (B), and 5 to 50 parts by weight of a filler, said film satisfies the following relationType: ApplicationFiled: July 22, 2003Publication date: May 20, 2004Inventors: Kouichirou Taniguchi, Shingetsu Yamada
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Publication number: 20030180510Abstract: A multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, can be ideally applied to low volume high mix manufacturing configurations, and also has little impact on the environment is provided, together with a semiconductor device mounting board using such a multilayer wiring board, and a method of manufacturing such a multilayer wiring board. In the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating substrate formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: ApplicationFiled: February 3, 2003Publication date: September 25, 2003Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Publication number: 20030178726Abstract: The present invention provides a semiconductor device integrated multilayer wiring board with a high degree of heat resistance, which is capable of low temperature fusion without the occurrence of resin flow, enables high precision, finely detailed conductive wiring, thereby enabling the production of high density, ultra small three dimensional mounting modules and the like, can also be ideally applied to low volume high mix manufacturing configurations, and has little impact on the environment, and also provides a method of manufacturing such a semiconductor device integrated multilayer wiring board. In the semiconductor device integrated multilayer wiring board, a wiring substrate is formed by embedding conductive wiring within an insulating substrate, formed from a thermoplastic resin composition comprising a polyarylketone resin with a crystalline melting peak temperature of at least 260° C.Type: ApplicationFiled: February 3, 2003Publication date: September 25, 2003Inventors: Minoru Ogawa, Masahiro Izumi, Shigeyasu Itoh, Shingetsu Yamada, Shuuji Suzuki, Hiroo Kurosaki
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Patent number: 6499217Abstract: An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress. The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260° C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230° C.Type: GrantFiled: February 6, 2001Date of Patent: December 31, 2002Assignees: Mitsubishi Plastics Inc., Denso CorporationInventors: Shingetsu Yamada, Jun Takagi, Koichiro Taniguchi, Kaoru Nomoto, Toshihiro Miyake, Kazuya Sanada, Makoto Totani
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Patent number: 6228467Abstract: A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230° C. and the peak temperature of crystal fusion is at least 260° C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion &Dgr;Hm and the heat of crystallization &Dgr;Hc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5.Type: GrantFiled: September 21, 1999Date of Patent: May 8, 2001Assignees: Mitsubishi Plastics, Inc., Denso CorporationInventors: Kouichirou Taniguchi, Jun Takagi, Hideo Yamano, Shingetsu Yamada, Kouji Kondo, Kaoru Nomoto
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Patent number: 5441804Abstract: A magneto-optical recording medium has on the substrate a recording layer made of a multi-layered metallic thin film comprising a first unit layer and a second unit layer. The first unit layer is composed of (Fe.sub.x Co.sub.1-x).sub.1-y M.sub.y where M represents at least one metal selected from the group consisting of Pt, Pd and Au, 0.5.ltoreq..times..ltoreq.1.0, and 0.01.ltoreq.y.ltoreq.0.1. The second unit layer is composed of a% least one metal selected from the group consisting of Nd, Dy, Gd and Tb. The first and second unit layers are superimposed alternately one on another.Type: GrantFiled: August 4, 1994Date of Patent: August 15, 1995Assignee: Mitsubishi Plastics Industries LimitedInventors: Toshiyuki Akitake, Shingetsu Yamada