Patents by Inventor Shingo Higuchi

Shingo Higuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111931
    Abstract: Trial manufacturing condition proposing system includes a characteristic evaluation data preprocessing unit, a feature value selection processing unit, a regression model creation processing unit, and a trial manufacturing condition proposing processing unit. The characteristic evaluation data preprocessing unit applies preprocessing to the characteristic evaluation data indicating an evaluation result of characteristics of the material. The feature value selection processing unit executes feature value selection processing on the characteristic evaluation data to which the preprocessing has been applied. The regression model creation processing unit executes regression model creation processing on the characteristic evaluation data, to which the preprocessing has been applied, based on the result of the feature value selection processing.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 4, 2024
    Applicant: NGK INSULATORS, LTD.
    Inventors: Yuki OKA HASHIMOTO, Fukunaga HIGUCHI, Shingo SOKAWA
  • Patent number: 11900772
    Abstract: A mobile terminal includes: a processor that acquires a type of a product sold by weight; and a transceiver connected to the processor and that establishes intercommunication with a weighing device that weighs the product sold by weight; a storage connected to the processor. The processor causes the transceiver to acquire, from the weighing device, a weight value of the product sold by weight weighed by the weighing device. The processor registers, in the storage, the type of the product and the weight value that corresponds to the type of the product.
    Type: Grant
    Filed: March 7, 2021
    Date of Patent: February 13, 2024
    Assignee: Teraoka Seiko Co., LTD
    Inventors: Kazuya Sasaki, Tomoki Kaneko, Naoto Kurosaki, Shingo Higuchi, Kazuki Watanabe, Fumikatu Saitoh, Akiko Yoshikawa, Sayaka Tomori
  • Publication number: 20240044425
    Abstract: A pipe joint includes: an inner ring having a bulge portion to be press-fitted into an end portion of the tube; a joint body having an inner circumference into which an end portion of the inner ring is to be press-fitted, and having an external thread portion on an outer circumference thereof; and a union nut having an internal thread portion to be tightened to the external thread portion, and configured to press the end portion of the tube when the internal thread portion is tightened to the external thread portion. The bulge portion has a tapered portion configured to generate a surface pressure between the tube and the tapered portion by pressing by the union nut. An outer circumferential surface of the tapered portion has a concave surface portion formed in a concave surface shape in an axial cross-sectional view.
    Type: Application
    Filed: October 4, 2021
    Publication date: February 8, 2024
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Yohei Okawa, Ayumi Kurosaki, Shingo Higuchi, Kazukiyo Teshima
  • Publication number: 20230349492
    Abstract: A tapered surface 14 is formed at each axially outer end portion of an inner circumferential surface 3a of a gasket 3 such that a diameter thereof gradually increases from an axially inner side toward an axially outer end thereof in a state before an annular primary sealing portion 11 of the gasket 3 is press-fitted into an annular primary sealing groove 2b of a fluid device 2. A diameter increase starting point P1 of the tapered surface 14 is located in a range R from a deformation starting point position P2 serving as a starting point from which the inner circumferential surface 3a is deformed due to the primary sealing portion 11 receiving external force form the fluid device 2 when the primary sealing portion 11 is press-fitted into the primary sealing groove 2b, to a center position P3 in an axial direction of the inner circumferential surface 3a.
    Type: Application
    Filed: June 4, 2021
    Publication date: November 2, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Kiyotaka OHMAE, Masashi KATANAYA, Ayumi KUROSAKI, Shingo HIGUCHI, Kazukiyo TESHIMA
  • Patent number: 11708928
    Abstract: A resin joint includes a joint body having a flow path, sleeves, and union nuts that fix tubes to the joint body. The joint body has a body portion with a curved inner peripheral surface and a straight portion protruding from an end portion of the body portion. The straight portion has outer and inner cylindrical portions radially arranged inside the outer cylindrical portion. An end portion of the inner cylindrical portion is positioned closer to the body portion than is an end portion of the outer cylindrical portion. A groove portion extending parallel with the outer and inner cylindrical portions in an axial direction is formed between an inner peripheral surface of the outer cylindrical portion and an outer peripheral surface of the inner cylindrical portion. The tube is fixed to the joint body such that a press-fit portion of the sleeve is press-fitted in the groove portion.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: July 25, 2023
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Tomoyuki Koike, Hiroki Sakamoto, Shingo Higuchi, Kiyotaka Ohmae, Tomohiro Adachi
  • Publication number: 20230175621
    Abstract: An inner ring 4 of a pipe joint 1 includes a bulge portion 6 formed at an axially outer end portion thereof so as to project toward a radially outer side, and to be press-fitted into an end portion of a tube 8, and has a fluid flow passage 4a formed on a radially inner side of the bulge portion 6. The bulge portion 6 is formed so as to be tapered from an axially inner side toward an axially outer end thereof in an axial cross-sectional view, and has a flat surface 6e formed at the axially outer end thereof and extending in a radial direction.
    Type: Application
    Filed: March 31, 2021
    Publication date: June 8, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.,
    Inventors: Ayumi KUROSAKI, Shingo HIGUCHI, Kazukiyo TESHIMA
  • Patent number: 11668292
    Abstract: A rolling diaphragm 5 of a rolling diaphragm pump 1 has a movable portion 31 reciprocatable together with a piston 3, a fixed portion 32 fixed to a housing 2, and a thin film portion 33 connecting the movable portion 31 and the fixed portion 32 and bending due to reciprocation of the piston 3. A rubber layer 6 is overlaid on the thin film portion 33 without being adhered to the thin film portion 33, an end portion 6a on the movable portion 31 side of the rubber layer 6 is fixed to the piston 3, and an end portion 6b on the fixed portion 32 side of the rubber layer 6 is fixed to the housing 2.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: June 6, 2023
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Kazukiyo Teshima, Yu Notoji, Shingo Higuchi
  • Publication number: 20230151911
    Abstract: An inner ring of a pipe joint includes a first tapered surface formed at one axial end portion of an inner circumferential surface such that a diameter thereof gradually increases from another axial side toward one axial end thereof in a state before a bulge portion is press-fitted into an end portion of a tube. A diameter increase starting point of the first tapered surface is located in a range from a deformation starting point, which serves as a starting point from which an inner circumferential surface is deformed due to the bulge portion receiving external force from the tube when the bulge portion is press-fitted into the end portion of the tube, to a position, on the inner circumferential surface, corresponding to one axial end of an outer circumferential surface of a body portion.
    Type: Application
    Filed: March 9, 2021
    Publication date: May 18, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Ayumi KUROSAKI, Shingo HIGUCHI, Kazukiyo TESHIMA
  • Publication number: 20230045298
    Abstract: A resin joint includes a joint body having a flow path, sleeves, and union nuts that fix tubes to the joint body. The joint body has a body portion with a curved inner peripheral surface and a straight portion protruding from an end portion of the body portion. The straight portion has outer and inner cylindrical portions radially arranged inside the outer cylindrical portion. An end portion of the inner cylindrical portion is positioned closer to the body portion than is an end portion of the outer cylindrical portion. A groove portion extending parallel with the outer and inner cylindrical portions in an axial direction is formed between an inner peripheral surface of the outer cylindrical portion and an outer peripheral surface of the inner cylindrical portion. The tube is fixed to the joint body such that a press-fit portion of the sleeve is press-fitted in the groove portion.
    Type: Application
    Filed: October 13, 2020
    Publication date: February 9, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Tomoyuki KOIKE, Hiroki SAKAMOTO, Shingo HIGUCHI, Kiyotaka OHMAE, Tomohiro ADACHI
  • Publication number: 20230039578
    Abstract: An inner ring 4 of a pipe joint 1 includes a cylindrical body portion 5 having a communication hole 5a for providing communication between flow passage holes 2c and 8a of a joint body 2 and a tube 8, and an annular primary sealing portion 11 projecting from a radially inner side of an axially outer end portion of the body portion 5 toward an axially outer side and to be press-fitted into an annular primary sealing groove 2d formed on the joint body 2. The primary sealing portion 11 is formed so as to be tapered from an axially inner end thereof toward an axially outer end thereof in an axial cross-sectional view, and has a flat surface 11c extending from a radially outer end 11b of the axially outer end thereof toward the radially inner side.
    Type: Application
    Filed: January 14, 2021
    Publication date: February 9, 2023
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Ayumi KUROSAKI, Shingo HIGUCHI, Kazukiyo TESHIMA, Kiyotaka OHMAE, Masashi KATANAYA
  • Publication number: 20220213882
    Abstract: A rolling diaphragm 5 of a rolling diaphragm pump 1 has a movable portion 31 reciprocatable together with a piston 3, a fixed portion 32 fixed to a housing 2, and a thin film portion 33 connecting the movable portion 31 and the fixed portion 32 and bending due to reciprocation of the piston 3. A rubber layer 6 is overlaid on the thin film portion 33 without being adhered to the thin film portion 33, an end portion 6a on the movable portion 31 side of the rubber layer 6 is fixed to the piston 3, and an end portion 6b on the fixed portion 32 side of the rubber layer 6 is fixed to the housing 2.
    Type: Application
    Filed: February 7, 2020
    Publication date: July 7, 2022
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Kazukiyo TESHIMA, Yu NOTOJI, Shingo HIGUCHI
  • Publication number: 20210326828
    Abstract: A weighing and pricing device includes: a processor that executes a registration process for a product to be purchased by a customer; a transceiver that: establishes a connection between a mobile device possessed by the customer and the weighing and pricing device; and upon establishing the connection, receives, from the mobile device, identification information that identifies the mobile device; and a storage that stores information relating to the product and the identification information in association with each other. After the registration process is interrupted, the transceiver receives, from the mobile device, identification information. The processor specifies the product associated with the stored identification information that corresponds to the identification information received after the registration process. The processor recommences the registration process for the specified product.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Teraoka Seiko Co., Ltd.
    Inventors: Eriko Enatsu, Tomoki Kaneko, Naoto Kurosaki, Kazuya Sasaki, Shingo Higuchi, Kunio Mori, Kazuki Watanabe
  • Publication number: 20210313245
    Abstract: A semiconductor device includes a semiconductor chip having a passivation film, a stress relieving layer provided on the passivation film, and a groove formed in a periphery of a surface of the semiconductor chip, the groove being provided inside of an edge of the semiconductor chip, wherein the stress relieving layer is partly disposed in the groove.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 7, 2021
    Inventors: Osamu MIYATA, Masaki KASAI, Shingo HIGUCHI
  • Patent number: 11069591
    Abstract: A semiconductor device includes a semiconductor chip having a passivation film, a stress relieving layer provided on the passivation film, and a groove formed in a periphery of a surface of the semiconductor chip, the groove being provided inside of an edge of the semiconductor chip, wherein the stress relieving layer is partly disposed in the groove.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: July 20, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Osamu Miyata, Masaki Kasai, Shingo Higuchi
  • Publication number: 20210192902
    Abstract: A mobile terminal includes: a processor that acquires a type of a product sold by weight; and a transceiver connected to the processor and that establishes intercommunication with a weighing device that weighs the product sold by weight; a storage connected to the processor. The processor causes the transceiver to acquire, from the weighing device, a weight value of the product sold by weight weighed by the weighing device. The processor registers, in the storage, the type of the product and the weight value that corresponds to the type of the product.
    Type: Application
    Filed: March 7, 2021
    Publication date: June 24, 2021
    Applicant: Teraoka Seiko Co., Ltd.
    Inventors: Kazuya Sasaki, Tomoki Kaneko, Naoto Kurosaki, Shingo Higuchi, Kazuki Watanabe, Fumikatu Saitoh, Akiko Yoshikawa, Sayaka Tomori
  • Publication number: 20190393116
    Abstract: A semiconductor device includes a semiconductor chip having a passivation film, a stress relieving layer provided on the passivation film, and a groove formed in a periphery of a surface of the semiconductor chip, the groove being provided inside of an edge of the semiconductor chip, wherein the stress relieving layer is partly disposed in the groove.
    Type: Application
    Filed: September 4, 2019
    Publication date: December 26, 2019
    Inventors: Osamu MIYATA, Masaki KASAI, Shingo HIGUCHI
  • Publication number: 20190348683
    Abstract: In a flow path chip including a first plate, a second plate joined to the first plate, and a porous body disposed between the first plate and the second plate, the flow path chip having a flow path formed by the first plate and the second plate, wherein the flow path includes a storage portion storing the porous body, the storage portion is defined by a first surface formed by part of a surface of the first plate and a second surface formed by part of a surface of the second plate, at least part of the first surface and at least part of the second surface are each a surface of an easily-deformable layer, and the porous body is sandwiched between the first plate and the second plate in a state that at least part of the easily-deformable layer is deformed.
    Type: Application
    Filed: July 29, 2019
    Publication date: November 14, 2019
    Inventors: Yoshimune SUZUKI, Osamu SAKAI, Setsuo ISHIBASHI, Shingo HIGUCHI, Yoshihiro TAGUCHI
  • Patent number: 10431516
    Abstract: A semiconductor device includes a semiconductor chip having a passivation film, a stress relieving layer provided on the passivation film, and a groove formed in a periphery of a surface of the semiconductor chip, the groove being provided inside of an edge of the semiconductor chip, wherein the stress relieving layer is partly disposed in the groove.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 1, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Osamu Miyata, Masaki Kasai, Shingo Higuchi
  • Patent number: 9698112
    Abstract: A semiconductor device includes a semiconductor chip having a wire and a passivation film formed on the outermost surface with an opening partially exposing the wire. A resin layer is stacked on the semiconductor chip and provided with a through-hole in a position opposed to a portion of the wire facing the opening. A pad is formed on a peripheral portion of the through-hole in the resin layer and in the through-hole so that an external connection terminal is arranged on the surface thereof. The peripheral portion of the resin layer is formed more thickly than the remaining portion of the resin layer other than the peripheral portion.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: July 4, 2017
    Assignee: ROHM CO., LTD.
    Inventor: Shingo Higuchi
  • Patent number: D985739
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: May 9, 2023
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Atsushi Nakano, Shingo Higuchi, Kazukiyo Teshima