Patents by Inventor Shingo Hirano

Shingo Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11118980
    Abstract: To provide an infrared sensor that allows heat to be efficiently transferred from an insulating film to a heat sensitive element and has a good responsivity. The infrared sensor according to the present invention includes an insulating film 2; a pair of first adhesive electrodes 3A that is patterned on either surface of the insulating film; a pair of first terminal electrodes 4A that is patterned on either surface of the insulating film; a first heat sensitive element 5A that is provided on either surface of the insulating film and is connected to the pair of first adhesive electrodes; a pair of first pattern wiring parts 6A that is patterned on either surface of the insulating film with one end thereof being connected to the pair of first adhesive electrodes and the other end thereof being connected to the pair of first terminal electrodes; and a heat transfer film 7.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: September 14, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Nakamura, Kazuyoshi Tari, Shingo Hirano
  • Publication number: 20210280061
    Abstract: A communication terminal transmits a route search request for a destination to a server device and obtains a route searched from the server device. The terminal requests the server device for guidance information after starting up the communication terminal, the guidance information being used to provide movement guidance for a mobile unit and being targeted for at least an update target area around a current location among update target areas, the update target areas being areas whose terminal-side map information included in the communication terminal is an older version of map information than device-side map information included in the server device. The terminal receives the guidance information transmitted from the server device in response to the request for the guidance information, and provides movement guidance for the mobile unit using a guidance route set on the communication terminal and the received guidance information.
    Type: Application
    Filed: March 20, 2018
    Publication date: September 9, 2021
    Applicant: AISIN AW CO., LTD.
    Inventors: Hiroaki HIRANO, Shingo AOYAMA, Daisuke TANIZAKI
  • Publication number: 20210072086
    Abstract: To provide an infrared sensor that allows heat to be efficiently transferred from an insulating film to a heat sensitive element and has a good responsivity. The infrared sensor according to the present invention includes an insulating film 2; a pair of first adhesive electrodes 3A that is patterned on either surface of the insulating film; a pair of first terminal electrodes 4A that is patterned on either surface of the insulating film; a first heat sensitive element 5A that is provided on either surface of the insulating film and is connected to the pair of first adhesive electrodes; a pair of first pattern wiring parts 6A that is patterned on either surface of the insulating film with one end thereof being connected to the pair of first adhesive electrodes and the other end thereof being connected to the pair of first terminal electrodes; and a heat transfer film 7.
    Type: Application
    Filed: January 27, 2017
    Publication date: March 11, 2021
    Inventors: Kenji Nakamura, Kazuyoshi Tari, Shingo Hirano
  • Patent number: 10605651
    Abstract: The infrared sensor according to the present invention includes an insulating film; a pair of first terminal electrodes; a pair of second terminal electrodes; a first heat sensitive element; a second heat sensitive element; a pair of first pattern wiring parts and a pair of second pattern wiring parts that are patterned on either surface of the insulating film; an infrared-receiving region that is provided on the other surface of the insulating film so as to oppose to the first heat sensitive element; and an infrared reflection film that is formed on the other surface of the insulating film so as to avoid the infrared-receiving region and to cover at least the portion immediately above the second heat sensitive element, wherein the infrared reflection film has a thermal coupling part in proximity to a portion of the first pattern wiring part.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: March 31, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Nakamura, Kazuyoshi Tari, Shingo Hirano
  • Publication number: 20200080896
    Abstract: The infrared sensor mounting member of the present invention is able to mount an infrared sensor body, which includes an insulating substrate on which heat sensitive elements and and a plurality of the terminal electrodes are formed, on a mounting substrate by fixing it at the upper portion thereof and includes: an insulating mounting member main body and a plurality of conductive terminal members that are attached to the mounting member main body with the upper end thereof being connected to the terminal electrodes while the lower end thereof being connected to the mounting substrate when the infrared sensor mounting member is mounted thereon. The terminal members are made of a material having a higher thermal conductivity than that of the mounting member main body and have terminal pin portions 7a that are laterally projected.
    Type: Application
    Filed: December 26, 2017
    Publication date: March 12, 2020
    Inventors: Keiji Shirata, Shingo Hirano
  • Publication number: 20190049308
    Abstract: To provide an infrared sensor apparatus that has a small profile and has a small heat capacity of the light guiding path member, and therefore can measure a temperature with high accuracy. The present infrared sensor apparatus includes: an infrared sensor body and a light guiding path member that is provided so as to surround at least the infrared receiving surface of the infrared sensor body and that has an opening immediately above the infrared receiving surface, wherein the light guiding path member is made of a plate material and at least one of the surfaces surrounding the infrared receiving surface is an infrared reflecting surface that is composed of an inclined plate part with the surface thereof on the infrared receiving surface side being inclined towards the opening side.
    Type: Application
    Filed: January 31, 2017
    Publication date: February 14, 2019
    Inventors: Shingo Hirano, Kazuyoshi Tari, Yusuke Hosokawa, Kenzo Nakamura, Masashi Nishiyama, Kenji Nakamura, Koji Yotsumoto, Isao Kobayashi, Yoshihiro Higuchi
  • Publication number: 20190033142
    Abstract: To provide a temperature detection circuit that can detect the high-temperature anomaly of a fuser roller or the like with high accuracy over a wider range of temperature. The temperature detection circuit includes a differential output detection circuit portion C1 having a detection thermistor and a compensation thermistor configured to amplify a difference between an output of the detection thermistor and an output of the compensation thermistor and to detect it as a first differential output; a second differential amplifier portion C2 configured to amplify a difference between the first differential output and the output of the compensation thermistor and to output it as a second differential output; and an AD converter portion C3 configured to convert the output of the compensation thermistor and the second differential output into digital values.
    Type: Application
    Filed: January 27, 2017
    Publication date: January 31, 2019
    Inventors: Masashi Nishiyama, Shingo Hirano, Kazuyoshi Tari, Kenzou Nakamura
  • Publication number: 20190025115
    Abstract: The infrared sensor according to the present invention includes an insulating film; a pair of first terminal electrodes; a pair of second terminal electrodes; a first heat sensitive element; a second heat sensitive element; a pair of first pattern wiring parts and a pair of second pattern wiring parts that are patterned on either surface of the insulating film; an infrared-receiving region that is provided on the other surface of the insulating film so as to oppose to the first heat sensitive element; and an infrared reflection film that is formed on the other surface of the insulating film so as to avoid the infrared-receiving region and to cover at least the portion immediately above the second heat sensitive element, wherein the infrared reflection film has a thermal coupling part in proximity to a portion of the first pattern wiring part.
    Type: Application
    Filed: January 27, 2017
    Publication date: January 24, 2019
    Inventors: Kenji Nakamura, Kazuyoshi Tari, Shingo Hirano
  • Publication number: 20180266894
    Abstract: An abnormal temperature detection circuit according to the present invention includes: a differential output detection circuit portion C1 having a detection thermistor and a compensation thermistor configured to detect a differential output between an output of the detection thermistor and an output of the compensation thermistor; a threshold setting circuit portion C2 that is an analog circuit configured to change a determination threshold for determining whether a temperature detected by the detection thermistor is an abnormal temperature in accordance with the output of the compensation thermistor and to output the changed determination threshold; and an abnormal temperature determination circuit portion C3 configured to output an abnormal temperature detection signal when the differential output is lower than the determination threshold that has been output.
    Type: Application
    Filed: March 25, 2016
    Publication date: September 20, 2018
    Inventors: Masashi Nishiyama, Shingo Hirano, Kazuyoshi Tari, Kenzou Nakamura