Abstract: A luminance indicated by an HDR signal is appropriately displayed. A first image processing unit (22) converts, in accordance with a maximum luminance level indicated by an HDR signal input to the first image processing unit (22), a gradation performance indicated by the HDR signal into a prescribed gradation performance according to a display panel (10), and a panel control unit (27) converts, in accordance with the maximum luminance level indicated by the HDR signal and a maximum luminance displayable by the display panel (10), a gradation value indicated by the HDR signal into a gradation value displayable by the display panel (10).

Abstract: A luminance indicated by an HDR signal is appropriately displayed. A first image processing unit (22) converts, in accordance with a maximum luminance level indicated by an HDR signal input to the first image processing unit (22), a gradation performance indicated by the HDR signal into a prescribed gradation performance according to a display panel (10), and a panel control unit (27) converts, in accordance with the maximum luminance level indicated by the HDR signal and a maximum luminance displayable by the display panel (10), a gradation value indicated by the HDR signal into a gradation value displayable by the display panel (10).

Abstract: A seat slide device includes a lower rail, which is provided along a front-and-rear direction; an upper rail, which is movably engaged with the lower rail; a lock mechanism, which is configured to lock and unlock a movement of the upper rail; a walk-in mechanism, which makes a seat be movable into a walk-in area located by unlocking the lock mechanism; and a movable-range restriction unit which: allows the seat to move into the walk-in area when the seat is moved toward the walk-in area from a rear side in a state where the walk-in mechanism is operated; and prevents the seat from moving into the walk-in area when the seat is moved toward the walk-in area from the rear side in a state where the walk-in mechanism is not operated and the lock mechanism is unlocked.

Abstract: A seat slide device includes a lower rail, which is provided along a front-and-rear direction; an upper rail, which is movably engaged with the lower rail; a lock mechanism, which is configured to lock and unlock a movement of the upper rail; a walk-in mechanism, which makes a seat be movable into a walk-in area located by unlocking the lock mechanism; and a movable-range restriction unit which: allows the seat to move into the walk-in area when the seat is moved toward the walk-in area from a rear side in a state where the walk-in mechanism is operated; and prevents the seat from moving into the walk-in area when the seat is moved toward the walk-in area from the rear side in a state where the walk-in mechanism is not operated and the lock mechanism is unlocked.

Abstract: In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of the internal circuit. Also, a plurality of pads are arranged on the peripheral edge of the internal circuit. Each of the pads is electrically connected to one of the peripheral circuit units.

Abstract: A seat having a collision stopper (51) activated in a short time period in collision. The seat is constituted of a supporting link (23), a stopper link (55), a recess/ridge surface (61), a stopper (65), and urging means (67). The supporting link (23) is installed at its upper portion to the floor side and at its lower portion to the seat cushion side, supporting a seat cushion, and adjusts the height of the seat cushion by inclination in the forward and backward directions in the vertical plane. The stopper link (55) is attached at its base end section to the floor side such that a rotation end section is rotatable in the forward and backward directions in a vertical plane. The stopper link (55) has, on its rotation end section side, a projection (57) projecting sideward. The recess/ridge surface (61) is provided on the supporting link (23) side, extending in the direction intersecting the movement path of the projection.

Abstract: The present invention provides a seat having a colliding stopper 51 operated for a short time at a time of collision.

Abstract: In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of the internal circuit. Also, a plurality of pads are arranged on the peripheral edge of the internal circuit. Each of the pads is electrically connected to one of the peripheral circuit units.

Abstract: The purpose of the present invention is to provide a portable-type memory medium such as a compact flash, a memory stick, etc., or a memory medium adapter that is to be connected to smart media, an SD card, a micromedia card, etc., concerning which the memory data [of that portable-type memory medium or medium adapter] cannot be accessed by another person if the personal identification numbers, etc., that are inputted from an external portion are not correct.

Abstract: A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; andfixedly securing the IC module to the card substrate.

Abstract: The electronic clinical thermometer of the present invention has a temperature sensing portion (3), a control signal generating circuit (2) for generating a control signal for controlling operation of each of structural elements, a converting circuit (4) for converting an output signal generated from the temperature sensing portion into a digital signal, a temperature measuring section (6) for measuring the temperature based on the digital signal, storage circuits (7) for storing and updating a maximum value of the temperature measured by the temperature measuring section in order. Data comparing circuits (8) are provided for comparing the temperature stored in the storage circuits with a present measured value. Temperature rise detecting means (21) is provided for detecting a rising amount of the temperature based on a compared result of the data comparing circuits, and a buzzer (103) is provided for informing the rise of the temperature based on a signal of the temperature rise detecting means.

Abstract: A heavy-load driving device for a electronic watch is provided that assures reliable timekeeping operation and enables proper drive in accordance with the power supply voltage level. When drive command circuit generates an alarm-coincidence signal Sa, this signal Sa causes a preparatory judging circuit 10 to operate, so as to make a judgment, in accordance with the reduced power supply voltage level under a given load condition, as to whether or not to allow drive of a beeper device 31, a drive-enabling signal Svm being output if the judgment is to allow drive. By doing this, a heavy-load voltage detection circuit 21 starts to output a drive-time judgment signal Pvh which indicates the power supply voltage level judgment results.

Abstract: A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A device for packaging many memory IC chips having a plurality of common connecting terminals on a main circuit board. A plurality of IC chips are packaged on an auxiliary board to make an IC chip unit, and a plurality of IC chip units are aligned on the main circuit board. The connections between unit-connecting terminals provided on the respective IC chip units and the main circuit board are made by means of wiring patterns on the main circuit board.

Abstract: An IC-packaged device comprises a lower plate which has wiring patterns at least on an upper surface; an upper plate which has upper surface wiring patterns and at least an opening hole and are superimposed on the lower plate when used; and a plurality of IC chips which has a lot of connecting terminal groups mounted on the upper plate. In this structure, some of the connecting terminal groups of the plurality of IC chips are wire-bonded to the wiring patterns on the upper plate, while the other of the connecting terminal groups of the plurality of IC chips pass through the opening hole in the upper plate and are wire-bonded directly to the wiring patterns on the lower plate.

Abstract: An electronic timepiece includes a plurality of light-receiving elements arranged to receive external light, a light-receiving condition discriminator for discriminating a light-receiving condition of each light-receiving element, and a circuit to be controlled in response to an output signal from the light-receiving condition discriminator. The light-receiving condition discriminator discriminates that the light-receiving condition of a central one of three light-receiving elements among the plurality of light-receiving elements is different from those of end light-receiving elements, and thereupon generates an output signal.