Patents by Inventor Shingo KAGAWA

Shingo KAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12037624
    Abstract: A mutant of a trichoderma filamentous fungus has a mutation that results in lost or lowered function of a beta-adaptin large subunit, or a mutation in an amino acid sequence that forms the beta-adaptin large subunit. A method produces a protein while maintaining a low viscosity in a culture solution during culturing by using the mutant.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: July 16, 2024
    Assignee: Toray Industries, Inc.
    Inventors: Yusuke Kagawa, Shingo Hiramatsu, Katsushige Yamada
  • Publication number: 20240075662
    Abstract: In a molded body manufacturing method, after a raw material is put into a cavity of a mold, at least a part of the mold is irradiated with electromagnetic waves, or at least part of the mold is placed in an alternating electric field, to mold a molded body. The mold has a heating body, which absorbs the electromagnetic waves to generate heat or is placed in the alternating electric field to generate heat, outside the cavity. In at least part of a space between the heating body and the cavity, a transmission amount suppressing body that suppresses the amount of transmission of the electromagnetic waves or the alternating electric field into the cavity is provided, or at least part of the cavity is composed of the transmission amount suppressing body. When the heating body generates heat, the heat is transmitted to the raw material to perform molding.
    Type: Application
    Filed: January 11, 2022
    Publication date: March 7, 2024
    Inventor: Shingo KAGAWA
  • Publication number: 20220168968
    Abstract: A resin molding method is capable of reducing the use amount of micropellets and obtaining a resin molded article having required characteristics. A resin molding method includes a disposing step of disposing a preliminary molded body laminated and formed in a three-dimensional shape in a molding die, a filling step of heating and melting the preliminary molded body by an electromagnetic wave transmitted through the molding die and filling the molding die with a molten resin material, and a cooling step of cooling and solidifying the molten resin material in the molding die. In the cooling step, a resin molded article integrated so as to eliminate a lamination interface of the preliminary molded body is formed in the molding die.
    Type: Application
    Filed: March 24, 2020
    Publication date: June 2, 2022
    Applicant: micro-AMS Inc.
    Inventors: Fumio KURIHARA, Shingo KAGAWA