Abstract: A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 ?m or greater but 3.0 ?m or less. A reduction ratio of the extrusion molding is 8 or less.

Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: An object of the present invention is to provide an adhesive composition for a printed wiring board, the adhesive composition having a good heat resistance. Another object of the present invention is to provide a coverlay for a printed wiring board, a copper-clad laminate, and a printed wiring board, all of which use the adhesive composition for a printed wiring board. The present invention provides an adhesive composition for a printed wiring board, the adhesive composition containing a siloxane-modified polyimide that includes structural units represented by formulae (1) and (2) below, an epoxy resin, and an inorganic filler. The siloxane-modified polyimide has a weight-average molecular weight (Mw) of 25,000 or more and 150,000 or less. A content of the inorganic filler is 10 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the siloxane-modified polyimide. In formulae (1) and (2), Ar represents a tetravalent aromatic tetracarboxylic acid residue, m is 0.35 or more and 0.

Abstract: There is provided a piezoelectric element, including: a porous fluororesin film made of a first fluororesin; and a nonporous fluororesin layer stacked on at least one surface of the porous fluororesin film and made of a second fluororesin, wherein the first fluororesin is different in type from the second fluororesin, and when 50 pores are selected in descending order from a pore having the longest thickness-direction length, of pores present in a cut surface of the porous fluororesin film in a thickness direction, an average value A50 of thickness-direction lengths of the 50 pores is 3 ?m or smaller.

Abstract: An object is to provide a metal-resin composite body (1) having good high-frequency signal transmission characteristics and good adhesiveness between a synthetic resin portion (2) and a base portion (3). The present invention provides a metal-resin composite body including a base portion composed of a metal, and a synthetic resin portion that is bonded to at least a part of an outer surface of the base portion and that contains a fluororesin as a main component, in which a silane coupling agent which has a functional group containing a N atom or a S atom is present in the vicinity of an interface between the base portion and the synthetic resin portion. The silane coupling agent is preferably an aminoalkoxysilane, an ureidoalkoxysilane, a mercaptoalkoxysilane, a sulfide alkoxysilane, or a derivative thereof. The silane coupling agent is preferably an aminoalkoxysilane to which a modifying group is introduced. The modifying group is preferably a phenyl group.

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract: There is provided a piezoelectric element, including: a porous fluororesin film made of a first fluororesin; and a nonporous fluororesin layer stacked on at least one surface of the porous fluororesin film and made of a second fluororesin, wherein the first fluororesin is different in type from the second fluororesin, and when 50 pores are selected in descending order from a pore having the longest thickness-direction length, of pores present in a cut surface of the porous fluororesin film in a thickness direction, an average value A50 of thickness-direction lengths of the 50 pores is 3 ?m or smaller.

Abstract: A biosensor measurement device for providing accurate measurement results within a short period of time by using only a very small amount of sample. The biosensor measurement device includes a power source, which is connected to a voltage regulator, a measurement instrument, and a controller for supplying power. When the biosensor chip is connected to the biosensor measurement device and a voltage is applied, the measurement instrument begins the measurement of a current value for the biosensor. When the measured current value or a measured charge value is greater than a reference value, the measurement is terminated in accordance with an instruction issued by the controller, and when the value is smaller than the reference value, the measurement is continued in accordance with a controller instruction.

Abstract: Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Abstract: Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.

Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract: In a biosensor system and its measuring instrument which determine that a biosensor chip has been inserted and measure biological information on a biological material supplied to the biosensor chip, the size of the biosensor chip is made small, the reliability of the measuring instrument is improved, and the product life becomes long. In addition, a measurement error of the biological information is suppressed in measuring the biological information by inserting a biosensor chip, which has a sensor electrode formed of an electrode member with an electric resistance value higher than a conductive metal, into the measuring instrument.

Abstract: A sensor device has a needle-integrated type sensor element which is detachably mounted therein and which has a sensor chip, a lancet needle fixed to an end portion of the sensor chip, and a flow path forming element provided compressibly and restorably at the end portion of the sensor chip, to which the lancet needle is fixed. The sensor device includes a puncture mechanism (a drive spring) configured to cause the sensor element to puncture a target, and a pressing mechanism (a pressure spring) configured to urge the sensor element to the extent that the sensor element is prevented from being detached from the target by a restoring force of the flow path forming element after the target is punctured.

Abstract: A biosensor cartridge capable of performing puncturing in an exact position, and easily collecting and measuring a sample of a puncture hole without requiring the operation of bringing a sample collection opening close to the puncture hole is provided. When tip portion 11a of biosensor chip body 11 is pushed against a subject M, elastic body 20 protruding from a tip portion 11a of biosensor chip body 11 is compressed, and puncturing tool 12 for puncturing protrudes. Thus, the subject M can be punctured. Additionally, if a pushing force is weakened, puncturing tool 12 is extracted from the subject M by the restoring force of elastic body 20, and the sample R flows out of the puncture hole. Additionally, cover member 19 is provided around biosensor chip body 11. Thus, when puncturing is performed by thin plate-shaped biosensor cartridge 10, biosensor chip body 11 can be prevented from deforming, and puncturing can be accurately performed in a desired puncturing position.

Abstract: A biosensor cartridge capable of making the collected amount of a sample required for measurement into a small quantity to reduce a user's burden, and easily collecting and measuring a sample of a puncture hole without requiring the operation of bringing a sample collection opening close to the puncture hole is provided. When one end portion of biosensor chip is pushed against subject, elastic body is compressed, and puncturing tool can protrude and perform puncturing. Additionally, if a pushing force is weakened, puncturing tool is extracted from subject by the restoring force of elastic body, and blood (sample) flows out of the puncture hole. In this case, since the puncture hole, and sample collection opening provided at biosensor chip are contained in enclosed half-open space formed by elastic body, even a small amount of blood (sample) can also be easily collected.

Abstract: There is provided a biosensor chip where the collecting amount necessary for the measurement is made small whereby burden of a user is reduced and, at the same time, a sample at a puncture opening is able to be easily collected and measured without an operation of making the sample collection opening nearer the puncture opening. When an end of a main body chip is pushed onto a test body, an elastic body installed at an end of the main body chip is compressed and a device for puncture is produced whereby the test body is able to be punctured. When the pushing force is made weak, the device for puncture is pulled out from the test body due to resilience of the elastic body and a sample is flown out from the puncture opening.

Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.