Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

Abstract: The density of a treatment fluid in exhaust gas is reduced, the amount of the treatment fluid that flows into exhausting equipment connected to a substrate treatment apparatus is reduced, and a load on the exhausting equipment is reduced. A substrate treatment apparatus includes: a substrate treating unit that treats a substrate; a treatment fluid supply unit that supplies, to the substrate treating unit, a treatment fluid used to treat the substrate; and an exhaust gas treating unit into which an exhaust gas containing the treatment fluid discharged from the substrate treating unit is introduced. The exhaust gas treating unit includes spray nozzles that spray a solvent toward the exhaust gas, the solvent dissolving the treatment fluid, thereby reducing the density of the treatment fluid in the exhaust gas. The exhaust gas treating unit has porous dispersion plates that cause the exhaust gas to disperse.

Abstract: The density of a treatment fluid in exhaust gas is reduced, the amount of the treatment fluid that flows into exhausting equipment connected to a substrate treatment apparatus is reduced, and a load on the exhausting equipment is reduced. A substrate treatment apparatus includes: a substrate treating unit that treats a substrate; a treatment fluid supply unit that supplies, to the substrate treating unit, a treatment fluid used to treat the substrate; and an exhaust gas treating unit into which an exhaust gas containing the treatment fluid discharged from the substrate treating unit is introduced. The exhaust gas treating unit includes spray nozzles that spray a solvent toward the exhaust gas, the solvent dissolving the treatment fluid, thereby reducing the density of the treatment fluid in the exhaust gas. The exhaust gas treating unit has porous dispersion plates that cause the exhaust gas to disperse.