Abstract: A template according to the present embodiment is a template used in a lithography process of a semiconductor manufacturing process. A first substrate includes a first face, a second face protruded from a portion of the first face, and a lateral face being a lateral face positioned between the second face and the first face and inclined with respect to the second face at a connection portion to the second face. A first material film is provided at least on the lateral face.

Abstract: A template manufacturing method includes preparing a structure including a first substrate and a stacked body that is provided on the first substrate, the stacked body including a first lower layer including a first material, a first upper layer provided on the first lower layer including a second material different from the first material, and a first cover layer provided on a first cover region of the first upper layer and including a third material different from the second material. The method further includes forming a first resist layer on a portion of the first cover layer and on a first portion of the first upper layer, and exposing a second portion of the upper layer. The method yet further includes removing the second portion of the first upper layer using the first cover layer and the first resist layer as a mask.

Abstract: A template according to the present embodiment is a template used in a lithography process of a semiconductor manufacturing process. A first substrate includes a first face, a second face protruded from a portion of the first face, and a lateral face being a lateral face positioned between the second face and the first face and inclined with respect to the second face at a connection portion to the second face. A first material film is provided at least on the lateral face.

Abstract: A template manufacturing method includes preparing a structure including a first substrate and a stacked body that is provided on the first substrate, the stacked body including a first lower layer including a first material, a first upper layer provided on the first lower layer including a second material different from the first material, and a first cover layer provided on a first cover region of the first upper layer and including a third material different from the second material. The method further includes forming a first resist layer on a portion of the first cover layer and on a first portion of the first upper layer, and exposing a second portion of the upper layer. The method yet further includes removing the second portion of the first upper layer using the first cover layer and the first resist layer as a mask.

Abstract: A template manufacturing method includes preparing a structure including a first substrate and a stacked body that is provided on the first substrate, the stacked body including a first lower layer including a first material, a first upper layer provided on the first lower layer including a second material different from the first material, and a first cover layer provided on a first cover region of the first upper layer and including a third material different from the second material. The method further includes forming a first resist layer on a portion of the first cover layer and on a first portion of the first upper layer, and exposing a second portion of the upper layer. The method yet further includes removing the second portion of the first upper layer using the first cover layer and the first resist layer as a mask.

Abstract: A method of manufacturing a replica template includes preparing a substrate including a first protruding portion protruding from a first surface of the substrate and having a patterning surface thereon, forming a first mask pattern over the patterning surface, the first mask pattern comprising a convex portion having a smaller width than the patterning surface and a pattern disposed on the convex portion, removing a portion of the first protruding portion using the first mask pattern as a mask to produce a second protruding portion on the first protruding portion, and forming a pattern in the patterning surface on the second protruding portion by transferring the shape of the pattern of the first mask pattern into the patterning surface on the second protruding portion.

Abstract: According to one embodiment, an original plate such as an imprint template or the like, comprises a substrate having a first surface. A pattern region is on the first surface. An impurity layer is within the substrate in a plane parallel to the first surface. The pattern region is within an outer perimeter of the impurity layer when viewed from a direction orthogonal to the first surface.

Abstract: A template substrate according to an embodiment includes a first face and a second face on an opposite side to the first face. A first region is located on the first face to be protruded from a peripheral portion thereof. A second region is located at least at an end portion of the first region, and is a region in which an alignment mark used at a time of transfer of a pattern is intended to be formed. The second region contains a first impurity and a second impurity.

Abstract: A method of manufacturing a replica template includes preparing a substrate including a first protruding portion protruding from a first surface of the substrate and having a patterning surface thereon, forming a first mask pattern over the patterning surface, the first mask pattern comprising a convex portion having a smaller width than the patterning surface and a pattern disposed on the convex portion, removing a portion of the first protruding portion using the first mask pattern as a mask to produce a second protruding portion on the first protruding portion, and forming a pattern in the patterning surface on the second protruding portion by transferring the shape of the pattern of the first mask pattern into the patterning surface on the second protruding portion.

Abstract: A mask includes a plurality of line patterns provided on a substrate, the plurality of line patterns each including a line comprising a plurality of first layers and a plurality of second layers alternately stacked on the substrate. The lines of the plurality of line patterns extend in a first direction and the lines of the plurality of line patterns are spaced in a second direction crossing the first direction. A line of one of the plurality of line patterns has a first portion and a second portion on a side of the first portion in the first direction, the first portion wider than the second portion in the second direction.

Abstract: In a pattern formation method according to an embodiment, a resist pattern is formed on a first film formed on a substrate. In the process for forming the resist pattern, the resist pattern includes a first pattern including a defect in a predetermined region on the first film. Next, a second film is accumulated on the first pattern in the predetermined region. Furthermore, a second pattern is formed in the first film with the resist pattern and the second film. Then, a third pattern is formed in the predetermined region on the first film.

Abstract: A template manufacturing method includes preparing a structure including a first substrate and a stacked body that is provided on the first substrate, the stacked body including a first lower layer including a first material, a first upper layer provided on the first lower layer including a second material different from the first material, and a first cover layer provided on a first cover region of the first upper layer and including a third material different from the second material. The method further includes forming a first resist layer on a portion of the first cover layer and on a first portion of the first upper layer, and exposing a second portion of the upper layer. The method yet further includes removing the second portion of the first upper layer using the first cover layer and the first resist layer as a mask.

Abstract: A mask includes a plurality of line patterns provided on a substrate, the plurality of line patterns each including a line comprising a plurality of first layers and a plurality of second layers alternately stacked on the substrate. The lines of the plurality of line patterns extend in a first direction and the lines of the plurality of line patterns are spaced in a second direction crossing the first direction. A line of one of the plurality of line patterns has a first portion and a second portion on a side of the first portion in the first direction, the first portion wider than the second portion in the second direction.

Abstract: A template substrate according to an embodiment includes a first face and a second face on an opposite side to the first face. A first region is located on the first face to be protruded from a peripheral portion thereof. A second region is located at least at an end portion of the first region, and is a region in which an alignment mark used at a time of transfer of a pattern is intended to be formed. The second region contains a first impurity and a second impurity.

Abstract: In a pattern formation method according to an embodiment, a resist pattern is formed on a first film formed on a substrate. In the process for forming the resist pattern, the resist pattern includes a first pattern including a defect in a predetermined region on the first film. Next, a second film is accumulated on the first pattern in the predetermined region. Furthermore, a second pattern is formed in the first film with the resist pattern and the second film. Then, a third pattern is formed in the predetermined region on the first film.

Abstract: According to one embodiment, an imprint mask includes a quartz plate. The quartz plate has a plurality of concave sections formed in part of an upper surface on the quartz plate, and impurities are contained in a portion between the concave sections in the quartz plate.

Abstract: According to one embodiment, in a method of repairing a defect on a template substrate for imprint lithography using a charged particle beam, a drift correction mark to correct drift of the charged particle beam is formed on the template substrate. The defect on the template substrate is repaired while correcting the drift of the charged particle beam with reference to the drift correction mark. The drift correction mark is removed.

Abstract: According to one embodiment, a template substrate includes a substrate and a mask. The substrate includes a mesa region formed in a central portion of an upper surface of the substrate. The mesa region is configured to protrude more than a region of the substrate around the mesa region. An impurity is introduced into an upper layer portion of a partial region of a peripheral portion of the mesa region. The mask film is provided on the upper surface of the substrate.

Abstract: The substrate storing case includes a base being made of quartz glass, and having a supporting part that is formed on an upper surface thereof and supports a substrate. The substrate storing case includes a top cover being made of quartz glass, and being in contact with the base to cover the substrate on the upper surface of the base. The substrate includes a first absorptive member that absorbs infrared rays and generates heat. The base or the top cover has an intake port that is in communication with a space enclosed by the upper surface of the base and the top cover and is capable of being opened and closed, and an outlet port that is in communication with the space and is capable of being opened and closed.

Abstract: According to one embodiment, a surface state evaluation apparatus includes an imaging unit and a processing unit. The imaging unit is configured to image a first region and a second region of a surface of a sample. A plurality of liquid droplets are provided in the first region, and a plurality of liquid droplets are provided in the second region. The processing unit is configured to evaluate a state of the surface based on a result of comparing a first image of the first region imaged by the imaging unit and a second image of the second region imaged by the imaging unit.