Patents by Inventor Shingo KANZAKI

Shingo KANZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate and electronic device
    Patent number: 9609750
    Abstract: In a package substrate, adjacent bumps in a first array of bumps being an outermost array arranged along a first side of the package substrate are arranged being shifted in a first axial direction that is a normal direction of the first side and in a second axial direction that intersects perpendicularly with the first axial direction in a plan view. Adjacent bumps in a second array of bumps arranged in the inside of the first array of bumps are arranged being shifted in the first axial direction and in the second axial direction in a plan view.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 28, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventor: Shingo Kanzaki
  • PACKAGE SUBSTRATE AND ELECTRONIC DEVICE
    Publication number: 20140060912
    Abstract: In a package substrate, adjacent bumps in a first array of bumps being an outermost array arranged along a first side of the package substrate are arranged being shifted in a first axial direction that is a normal direction of the first side and in a second axial direction that intersects perpendicularly with the first axial direction in a plan view. Adjacent bumps in a second array of bumps arranged in the inside of the first array of bumps are arranged being shifted in the first axial direction and in the second axial direction in a plan view.
    Type: Application
    Filed: June 28, 2013
    Publication date: March 6, 2014
    Inventor: Shingo KANZAKI