Patents by Inventor Shingo Kashiwada

Shingo Kashiwada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion
    Patent number: 10730755
    Abstract: A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 4, 2020
    Assignee: JGC Catalysts and Chemicals Ltd.
    Inventors: Yuji Tawarazako, Yoshinori Wakamiya, Shingo Kashiwada, Kazuaki Inoue, Kazuhiro Nakayama, Michio Komatsu
  • Silica-Based Composite Fine-Particle Dispersion, Method for Producing Same, and Polishing Slurry Including Silica-Based Composite Fine-Particle Dispersion
    Publication number: 20180105428
    Abstract: A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them.
    Type: Application
    Filed: March 30, 2016
    Publication date: April 19, 2018
    Inventors: Yuji Tawarazako, Yoshinori Wakamiya, Shingo Kashiwada, Kazuaki Inoue, Kazuhiro Nakayama, Michio Komatsu