Abstract: A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of the pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, a post-stage transfer mechanism. The substrate transfer method includes comparing an exposure apparatus cycle time with a section transfer time required to transfer the substrate from a transfer section by the second transfer mechanism to a transfer section by the post-stage transfer mechanism; and setting the section transfer time based on a result of the comparing.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1.

Abstract: Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1.

Abstract: Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1.

Abstract: Disclosed herein is a coating and developing apparatus 1 whose decreases in substrate-conveying accuracy can be suppressed. A processing block S2 of the coating and developing apparatus 1 includes multiple resist-film forming blocks G2, G3, and a developing block G1. A conveyance element 12 for substrate loading into the processing block S2 is provided to convey substrates W from a carrier C to the resist-film forming blocks G2, G3. Also, a conveyance element I for substrate loading into an exposure apparatus S4 is provided in an interface block S3 to load the substrates W into the exposure apparatus S4 and after unloading the substrates W from the exposure apparatus S4, convey the substrates W to the developing block G1.