Patents by Inventor Shingo KAWATA

Shingo KAWATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10998108
    Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: May 4, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu Okuno, Yoshiaki Kobayashi, Tatsuya Nakatsugawa, Kengo Mitose, Akira Tachibana, Shingo Kawata
  • Patent number: 10351939
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: July 16, 2019
    Assignees: TOHOKU UNIVERSITY, FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD.
    Inventors: Toshihiro Omori, Shingo Kawata, Ryosuke Kainuma, Kiyohito Ishida, Toyonobu Tanaka, Kenji Nakamizo, Sumio Kise, Koji Ishikawa, Misato Nakano, Satoshi Teshigawara
  • Publication number: 20170076834
    Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 ?m/?m2 or less; a method of producing the same; and a terminal.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Yoshikazu OKUNO, Yoshiaki KOBAYASHI, Tatsuya NAKATSUGAWA, Kengo MITOSE, Akira TACHIBANA, Shingo KAWATA
  • Publication number: 20150225826
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Application
    Filed: March 16, 2015
    Publication date: August 13, 2015
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD, FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Shingo KAWATA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Kenji NAKAMIZO, Sumio KISE, Koji ISHIKAWA, Misato NAKANO, Satoshi TESHIGAWARA