Patents by Inventor Shingo Kouda
Shingo Kouda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123654Abstract: Provided is a separation and recovery apparatus for continuously separating and recovering, from a resin mixture containing a resin containing a hydrolyzable polymer and a resin containing a nonhydrolyzable polymer, a hydrolytic component a of the hydrolyzable polymer A and the nonhydrolyzable polymer B, the apparatus including: a crushing unit that crushes the resin mixture a melting/discharging unit that melts a crushed product obtained by the crushing unit to form a fluid and discharges the fluid at a high pressure; and a hydrothermal reaction treatment unit that continuously subjects the fluid discharged from the melting/discharging unit to a hydrothermal reaction treatment, wherein, in the melting/discharging unit, the hydrolyzable polymer A is hydrolyzed, and the hydrolytic component a thereof is dissolved and transferred into water permeating a sintered alloy diaphragm, thereby separating the nonhydrolyzable polymer B.Type: ApplicationFiled: December 15, 2023Publication date: April 18, 2024Applicant: TOPPAN INC.Inventors: Masaru WATANABE, Aritomo YAMAGUCHI, Osamu SATO, Yuuma IRISA, Akira TAKAMA, Kousuke NISHIMURA, Hiroki KUJIRAOKA, Hideki MIYAZAKI, Keita AKIMOTO, Takuya TAKAHATA, Daisuke KUGIMOTO, Shingo KOUDA, Satoshi HAMURA, Takahiro IMAI, Yumiko OMORI, Manabu KAWA
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Patent number: 11732118Abstract: An object of this invention is to provide a resin composition usable as a modifier with which the brittleness of a plastic material including a plurality of resins, such as a laminate of different kinds of materials collected for recycling, can be overcome and the impact resistance and elongation at break can be enhanced. Provided is a resin composition (A) including the following components (1) and (2): (1) a composition (a1) including at least two kinds of ethylene-vinyl acetate copolymers having different vinyl acetate contents; and (2) a copolymer (a2) that is at least one copolymer selected from an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer.Type: GrantFiled: August 13, 2021Date of Patent: August 22, 2023Assignee: TOSOH CORPORATIONInventors: Daisuke Kugimoto, Koki Kamiya, Shingo Kouda
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Publication number: 20220213356Abstract: The purpose is to provide a resin composition and a film for lid material which excel in sealability and adhesiveness to plastic containers, especially containers made of polyethylene terephthalate, polylactic acid, polystyrene, or polypropylene, and are suitably usable as sealant layers of lid materials for containers. Provided is a resin composition including: an ethylene-vinyl acetate copolymer (A) by 60-95 parts by weight, the ethylene-vinyl acetate copolymer (A) having a vinyl acetate content (VA) of 3-13% by weight, and having a ratio Qw between a weight-average molecular weight (Mw) and a number-average molecular weight (Mn) of 1.5-4.5; and a tackifier resin (B) by 5-40 parts by weight, where a total amount of (A) and (B) is 100 parts by weight.Type: ApplicationFiled: March 18, 2020Publication date: July 7, 2022Applicant: TOSOH CORPORATIONInventors: Takashi HEMMI, Isao MORISHITA, Shingo KOUDA
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Publication number: 20220106480Abstract: This invention has an object to provide: a resin composition excellent in impact resistance, flexibility, and recyclability obtained as a result of blending a specific ethylene-vinyl acetate copolymer composition with a brittle resin, a recycled resin, or a composite resin including two or more kinds of different resins mixed therein; and a molded article produced with use of the resin composition. The resin composition includes: a thermoplastic resin (A) in an amount of not less than 1 weight % and not more than 99 weight %; and an ethylene-vinyl acetate copolymer composition (B) in an amount of not less than 1 weight % and not more than 99 weight %, the ethylene-vinyl acetate copolymer composition (B) including two or more kinds of ethylene-vinyl acetate copolymers having different vinyl acetate contents, the total amount of (A) and (B) being 100 weight %.Type: ApplicationFiled: January 20, 2020Publication date: April 7, 2022Applicant: TOSOH CORPORATIONInventors: Daisuke KUGIMOTO, Daisuke KAWATO, Shingo KOUDA
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Publication number: 20220049075Abstract: An object of this invention is to provide a resin composition usable as a modifier with which the brittleness of a plastic material including a plurality of resins, such as a laminate of different kinds of materials collected for recycling, can be overcome and the impact resistance and elongation at break can be enhanced. Provided is a resin composition (A) including the following components (1) and (2): (1) a composition (a1) including at least two kinds of ethylene-vinyl acetate copolymers having different vinyl acetate contents; and (2) a copolymer (a2) that is at least one copolymer selected from an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer.Type: ApplicationFiled: August 13, 2021Publication date: February 17, 2022Applicant: TOSOH CORPORATIONInventors: Daisuke KUGIMOTO, Koki KAMIYA, Shingo KOUDA
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Patent number: 11248150Abstract: To provide an adhesive excellent in adhesion to a thermoplastic resin and an ethylene/vinyl alcohol copolymer. An adhesive comprising a hydrolyzate of a resin composition containing a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or an acrylic acid ester having a vinyl ester and/or acrylic acid ester content higher by at least 5 mol % than (A); and a modified product having (A) grafted by (B), and an adhesive resin composition comprising it.Type: GrantFiled: May 17, 2017Date of Patent: February 15, 2022Assignee: TOSOH CORPORATIONInventors: Daisuke Kawato, Midori Takayama, Makoto Oodake, Shingo Kouda
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Patent number: 10953642Abstract: To provide a laminate excellent in the oil resistance without using a polypropylene film for the innermost layer of a packaging material. A laminate comprising at least three layers (A), (B) and (C) in this order, wherein the layer (A) is composed of a polyolefin which satisfies the following requirements (a) to (c), the layer (B) is composed of an adhesive which satisfies the following requirements (d) to (f), and the layer (C) is a substrate comprising at least one layer: (a) density of from 900 to 970 kg/m3, (b) MFR of from 2 to 30 g/10 min, (c) film thickness of from 5 to 25 ?m, (d) film thickness of from 0.01 to 3.0 ?m, (e) glass transition temperature of from ?30 to +10° C., and (f) storage modulus E? at 20° C. of from 1.0×106 to 2.5×107 Pa.Type: GrantFiled: October 23, 2015Date of Patent: March 23, 2021Assignee: TOSOH CORPORATIONInventors: Daisuke Kawato, Shingo Kouda, Shigeki Iwamoto
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Publication number: 20190300763Abstract: To provide an adhesive excellent in adhesion to a thermoplastic resin and an ethylene/vinyl alcohol copolymer. An adhesive comprising a hydrolyzate of a resin composition containing a thermoplastic resin (A), a copolymer (B) of ethylene and a vinyl ester and/or an acrylic acid ester having a vinyl ester and/or acrylic acid ester content higher by at least 5 mol % than (A); and a modified product having (A) grafted by (B), and an adhesive resin composition comprising it.Type: ApplicationFiled: May 17, 2017Publication date: October 3, 2019Applicant: TOSOH CORPORATIONInventors: Daisuke KAWATO, Midori TAKAYAMA, Makoto OODAKE, Shingo KOUDA
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Publication number: 20170326854Abstract: To provide a laminate excellent in the oil resistance without using a polypropylene film for the innermost layer of a packaging material. A laminate comprising at least three layers (A), (B) and (C) in this order, wherein the layer (A) is composed of a polyolefin which satisfies the following requirements (a) to (c), the layer (B) is composed of an adhesive which satisfies the following requirements (d) to (f), and the layer (C) is a substrate comprising at least one layer: (a) density of from 900 to 970 kg/m3, (b) MFR of from 2 to 30 g/10 min, (c) film thickness of from 5 to 25 ?m, (d) film thickness of from 0.01 to 3.0 ?m, (e) glass transition temperature of from ?30 to +10° C., and (f) storage modulus E? at 20° C. of from 1.0×106 to 2.Type: ApplicationFiled: October 23, 2015Publication date: November 16, 2017Applicant: TOSOH CORPORATIONInventors: Daisuke KAWATO, Shingo KOUDA, Shigeki IWAMOTO
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Publication number: 20050112385Abstract: A resin composition for use in release film, including 95-99.99 weight % of an olefin type polymer, and 0.01-5 weight % of a polydimethylsiloxane having epoxy groups of which epoxy equivalent is not less than 500 g/mol and not more than 50,000 g/mol is prepared, and then the resultant resin composition is used.Type: ApplicationFiled: November 15, 2004Publication date: May 26, 2005Inventor: Shingo Kouda