Patents by Inventor Shingo KOZAKI

Shingo KOZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including an edge seal and plural pad pieces
    Patent number: 8492763
    Abstract: According to one embodiment, there is provided a semiconductor device including a semiconductor substrate, an edge seal, a plurality of pad pieces, and an insulating film pattern. The semiconductor substrate includes a chip area formed at an inward side of the semiconductor substrate when viewed in a direction perpendicular to a surface of the semiconductor substrate. The edge seal is disposed around the chip area on the surface to protect the chip area. The plurality of pad pieces are disposed on an edge region on the surface. The insulating film pattern covers edge portions of the plurality of pad pieces at a side of the edge seal, at least at one side of the chip area on the surface in a first direction and at least at one side of the chip area on the surface in a second direction.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: July 23, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Shingo Kozaki
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20120068176
    Abstract: According to one embodiment, there is provided a semiconductor device including a semiconductor substrate, an edge seal, a plurality of pad pieces, and an insulating film pattern. The semiconductor substrate includes a chip area formed at an inward side of the semiconductor substrate when viewed in a direction perpendicular to a surface of the semiconductor substrate. The edge seal is disposed around the chip area on the surface to protect the chip area. The plurality of pad pieces are disposed on an edge region on the surface. The insulating film pattern covers edge portions of the plurality of pad pieces at a side of the edge seal, at least at one side of the chip area on the surface in a first direction and at least at one side of the chip area on the surface in a second direction.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Shingo KOZAKI