Abstract: A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.

Abstract: A semiconductor device includes leads, a switching element, a control element that controls the switching element, and a resin member covering the switching element, the control element and parts of the respective leads. The leads include a drain lead connected to a drain electrode of the switching element, a source lead connected to a source electrode of the switching element, and at least one control lead connected to the control element. The resin member includes a drain exposed portion at which the drain lead is exposed, a source exposed portion at which the source lead is exposed, and a control exposed portion at which the control lead is exposed. The distance in a first direction between the drain exposed portion and the source exposed portion is larger than the distance in the first direction between the control exposed portion and the source exposed portion.

Abstract: A semiconductor device includes leads, a switching element, a control element that controls the switching element, and a resin member covering the switching element, the control element and parts of the respective leads. The leads include a drain lead connected to a drain electrode of the switching element, a source lead connected to a source electrode of the switching element, and at least one control lead connected to the control element. The resin member includes a drain exposed portion at which the drain lead is exposed, a source exposed portion at which the source lead is exposed, and a control exposed portion at which the control lead is exposed. The distance in a first direction between the drain exposed portion and the source exposed portion is larger than the distance in the first direction between the control exposed portion and the source exposed portion.