Patents by Inventor Shingo Mitsugi

Shingo Mitsugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11667763
    Abstract: A cellulose fiber dispersion polyethylene resin composite material formed by dispersing a cellulose fiber into a polyethylene resin, in which a proportion of the above-described cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and the polyethylene resin satisfies a relationship: 1.7>half-width (Log(MH/ML))>1.0 in a molecular weight pattern obtained by gel permeation chromatography measurement, and a formed body and a pellet using the same, a production method therefor, and a recycling method for the cellulose fiber adhesion polyethylene thin film piece.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 6, 2023
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou Hiroishi, Hidekazu Hara, Yuka Sawada, Masami Tazuke, Toshihiro Suzuki, Shingo Mitsugi
  • Publication number: 20230017246
    Abstract: A power cable 1 according to the present invention contains a propylene-based resin in a specific range as an insulating layer 13, and has a specific relationship between the cooling rate X at the time of manufacturing the interface portion in the insulating layer 13 with an inner semiconductive layer 12 and the cooling rate Y at the time of manufacturing the central portion of the insulating layer 13. Thus, not only the surface of the insulating layer 13 but also the inside of the insulating layer 13, the interface portion in the insulating layer 13 with the inner semiconductive layer 12, and the inside thereof are reliably cooled and cured. Therefore, the metal conductor 11 is not displaced from the center of the power cable 1 due to its own weight, and uneven thickness is less likely to occur.
    Type: Application
    Filed: September 12, 2022
    Publication date: January 19, 2023
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Kazuyoshi AKIZUKI, Shingo MITSUGI
  • Patent number: 11390724
    Abstract: A cellulose-fiber dispersion polyethylene resin composite material, formed by dispersing a cellulose fiber into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and wherein water absorption ratio satisfies the following formula; and a formed body and a pellet using the same, a production method therefor, and a recycling method for a cellulose-fiber adhesion polyethylene thin film piece. (water absorption ratio)<(cellulose effective mass ratio)2×0.01??[Formula].
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: July 19, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou Hiroishi, Hidekazu Hara, Yuka Sawada, Masami Tazuke, Toshihiro Suzuki, Shingo Mitsugi
  • Patent number: 11390723
    Abstract: A cellulose-aluminum-dispersing polyethylene resin composite material, in which a cellulose fiber and aluminum are dispersed into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin, and the cellulose fiber, and wherein water absorption ratio of the composite material satisfies the following formula: (Water absorption ratio)<(cellulose effective mass ratio)2×0.01;??[Formula]: a pellet and a formed body using the composite material, and a method of producing these.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: July 19, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hidekazu Hara, Yuka Sawada, Jirou Hiroishi, Masami Tazuke, Toshihiro Suzuki, Shingo Mitsugi
  • Publication number: 20210139664
    Abstract: A cellulose-fiber dispersion polyethylene resin composite material, formed by dispersing a cellulose fiber into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and wherein water absorption ratio satisfies the following formula; and a formed body and a pellet using the same, a production method therefor, and a recycling method for a cellulose-fiber adhesion polyethylene thin film piece. (water absorption ratio)<(cellulose effective mass ratio)2×0.01??[Formula].
    Type: Application
    Filed: August 23, 2017
    Publication date: May 13, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou HIROISHI, Hidekazu HARA, Yuka SAWADA, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Publication number: 20200172684
    Abstract: A cellulose fiber dispersion polyethylene resin composite material formed by dispersing a cellulose fiber into a polyethylene resin, in which a proportion of the above-described cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and the polyethylene resin satisfies a relationship: 1.7>half-width (Log(MH/ML))>1.0 in a molecular weight pattern obtained by gel permeation chromatography measurement, and a formed body and a pellet using the same, a production method therefor, and a recycling method for the cellulose fiber adhesion polyethylene thin film piece.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 4, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jirou HIROISHI, Hidekazu HARA, Yuka SAWADA, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Publication number: 20200079920
    Abstract: A cellulose-aluminum dispersion polyethylene resin composite material, formed by dispersing a cellulose fiber and aluminum into a polyethylene resin, in which the polyethylene resin satisfies a relationship: 1.7>half-width (Log(MH/ML))>1.0 in a molecular weight pattern to be obtained by gel permeation chromatography measurement, a pellet and a formed body using the composite material, and a production method therefor.
    Type: Application
    Filed: August 23, 2017
    Publication date: March 12, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuka SAWADA, Hidekazu HARA, Jirou HIROISHI, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Publication number: 20200062921
    Abstract: A cellulose-aluminum-dispersing polyethylene resin composite material, in which a cellulose fiber and aluminum are dispersed into a polyethylene resin, wherein a proportion of the cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin, and the cellulose fiber, and wherein water absorption ratio of the composite material satisfies the following formula: (Water absorption ratio)<(cellulose effective mass ratio)2×0.01; ??[Formula]: a pellet and a formed body using the composite material, and a method of producing these.
    Type: Application
    Filed: August 23, 2017
    Publication date: February 27, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hidekazu HARA, Yuka SAWADA, Jirou HIROISHI, Masami TAZUKE, Toshihiro SUZUKI, Shingo MITSUGI
  • Patent number: 8786110
    Abstract: A semiconductor device comprising a support plate, a semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes, a first insulation layer covering the circuit element surface of the semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes, a second insulation layer covering an upper part of the support plate and side parts of the semiconductor element, and wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: July 22, 2014
    Assignee: J-Devices Corporation
    Inventors: Hisakazu Marutani, Yasunari Iwami, Tomoshige Chikai, Tomoko Takahashi, Osamu Yamagata, Shingo Mitsugi, Chunghao Chen
  • Publication number: 20120074594
    Abstract: A semiconductor device comprising a support plate, a semiconductor element mounted on the support plate and including a circuit element surface having a plurality of first electrodes, a first insulation layer covering the circuit element surface of the semiconductor element, and including a plurality of first apertures exposing the plurality of first electrodes, a second insulation layer covering an upper part of the support plate and side parts of the semiconductor element, and wirings formed on an upper part of the first insulation layer and on an upper part of the second insulation layer, and electrically connected to the corresponding first electrodes.
    Type: Application
    Filed: March 30, 2011
    Publication date: March 29, 2012
    Applicant: J-DEVICES CORPORATION
    Inventors: Hisakazu MARUTANI, Yasunari Iwami, Tomoshige Chikai, Tomoko Takahashi, Osamu Yamagata, Shingo Mitsugi, Chunghao Chen