Patents by Inventor Shingo OGURA

Shingo OGURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125929
    Abstract: A target object detection apparatus (20) includes an acquisition unit (210), a likelihood information generation unit (220), and a determination unit (230). The acquisition unit (210) acquires an IF signal from an irradiation apparatus (10) at a plurality of timings. The likelihood information generation unit (220) executes, by processing the IF signal, processing of generating, with respect to each of a plurality of IF signals, likelihood information for a region (hereinafter, referred to as a target object region) having a possibility in that an accompaniment, i.e., a target object is present. The likelihood information indicates a distribution of presence probabilities of a target object in at least a height direction in a target object region. Then, the determination unit (230) determines a presence or absence of a target object, by using likelihood information generated for each of a plurality of target object regions.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 18, 2024
    Applicant: NEC Corporation
    Inventors: Tatsuya SUMIYA, Masayuki ARIYOSHI, Kazumine OGURA, Nagma Samreen KHAN, Shingo YAMANOUCHI, Toshiyuki NOMURA
  • Patent number: 11933885
    Abstract: A radar signal imaging device 30 includes: a transmission unit 31 which transmits a radar signal toward an object to be imaged that is a non-rigid body; a position estimation unit 32 which estimates the position of the object; an oscillation degree estimation unit 33 which estimates an oscillation degree which is a degree of change within a predetermined period in the relative positions of feature points constituting the object; and a synthetic aperture processing unit 34 which performs synthetic aperture processing on the radar signal reflected by the object on the basis of the estimated position of the object and the estimated oscillation degree.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: March 19, 2024
    Assignee: NEC CORPORATION
    Inventors: Kazumine Ogura, Masayuki Ariyoshi, Yuzo Senda, Osamu Hoshuyama, Taichi Tanaka, Daisuke Ikefuji, Shingo Yamanouchi
  • Patent number: 11914035
    Abstract: To shorten a waiting time for a belongings inspection, the present invention provides an inspection system 10 including an acquisition unit 11 that acquires material information including at least either one of a piece of personal unique information unique to each of inspection target persons, and a piece of environment information indicating a state value of an environment that changes at each inspection timing, and a determination unit 12 that determines a content of an inspection for the each inspection target person and/or at the each inspection timing, based on the material information.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: February 27, 2024
    Assignee: NEC CORPORATION
    Inventors: Tatsuya Sumiya, Shingo Yamanouchi, Masayuki Ariyoshi, Shinichi Morimoto, Masanori Sekido, Kazumine Ogura
  • Publication number: 20230165554
    Abstract: A medical image processing apparatus according to an embodiment includes processing circuitry. The processing circuitry is configured: to perform registration between one contrast image and each of a plurality of mask images; to calculate a plurality of matching degrees between the plurality of mask images and the one contrast image registered with each other, on the basis of the plurality of mask images and the one contrast image registered with each other; and to determine a difference between one of the mask images corresponding to a maximum matching degree among the plurality of matching degrees and the one contrast image, as one subtraction image corresponding to the one contrast image.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 1, 2023
    Applicant: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Kunio SHIRAISHI, Masanori MATSUMOTO, Hisato TAKEMOTO, Shingo OGURA
  • Publication number: 20200326816
    Abstract: A wiring body including: a resin portion; and a conductor portion disposed on the resin portion. The conductor portion includes: a lead wire with a mesh shape including first conductor wires, and a first terminal that is electrically connected to the lead wire and has a mesh shape including second conductor wires. The first conductor wires intersect with each other to form first meshes in a plan view of the wiring body, the second conductor wires intersect with each other to form second meshes in the plan view, and Expression (1) is satisfied: S2?S1 . . . (1). In Expression (1), S1 is a diameter of a first virtual circle inscribed in the first mesh and S2 is a diameter of a second virtual circle inscribed in the second mesh.
    Type: Application
    Filed: April 25, 2017
    Publication date: October 15, 2020
    Applicant: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Patent number: 10799945
    Abstract: A die casting apparatus according to an aspect of the present disclosure includes a sleeve 30 to which molten metal is supplied, and dies 10 and 20 configured to form a cavity C, in which the molten metal supplied to the sleeve 30 is injected into the cavity C through a runner R linking the sleeve 30 with the cavity C. A plurality of protrusions 22 are provided in the runner R, the plurality of protrusions 22 extending in a direction in which the molten metal flows and being arranged in a comb-teeth arrangement in a width direction of the runner R.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: October 13, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroyoshi Nakano, Yuji Inoue, Shingo Ogura, Yuta Tanaka, Toshimitsu Yamada, Yutaka Yoshida
  • Publication number: 20200310584
    Abstract: A wiring body includes: a first resin portion; and a first linear conductor portion disposed on the first resin portion. The first linear conductor portion includes a first end surface at a tip end of the first linear conductor portion in a first extending direction of the first linear conductor portion, and Expression (1) is satisfied: W1/T1?1 . . . (1), where, W1 is a first length obtained by projecting the first end surface on a plane parallel to the first extending direction, and T1 is a height of the first linear conductor portion.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 1, 2020
    Applicant: FUJIKURA LTD.
    Inventors: Hiroyuki Hirano, Shingo Ogura
  • Publication number: 20200192506
    Abstract: A wiring body includes: an insulating portion; a first conductor portion disposed on a first side of the insulating portion and including a first electrode portion; and a second conductor portion disposed on a second side of the insulating portion and including a second electrode portion. The first electrode portion has first thin lines intersecting each other and includes a first lattice formed by the first thin lines. The second electrode portion has second thin lines intersecting each other and includes a second lattice formed by the second thin lines. The first electrode portion and the second electrode portion are disposed to face each other such that, in a see-through plane view, the first electrode portion and the second electrode portion partially overlap in an overlapping region and do not overlap in a non-overlapping region other than the overlapping region.
    Type: Application
    Filed: December 25, 2017
    Publication date: June 18, 2020
    Applicant: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Patent number: 10528160
    Abstract: A wiring body includes an resin layer, a reticular electrode layer that includes first conductor wires arranged into the shape of a reticulation disposed on the resin layer, and a lead-out wiring layer connected to the reticular electrode layer disposed on the resin layer. The lead-out wiring layer includes a reticulation portion configured by gathering unit reticulations formed by being surrounded by second conductor wires. The second conductor wires are inclined with respect to an extending direction of the lead-out wiring layer. The unit reticulation includes an end portion that is an intersection point between the second conductor wires, The lead-out wiring layer includes a lateral end portion formed by arranging the unit reticulations side by side along the extending direction of the lead-out wiring layer. The lateral end portion of the lead-out wiring layer is closed by the second conductor wires.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: January 7, 2020
    Assignee: Fujikura Ltd.
    Inventor: Shingo Ogura
  • Publication number: 20200001357
    Abstract: A die casting apparatus according to an aspect of the present disclosure includes a sleeve 30 to which molten metal is supplied, and dies 10 and 20 configured to form a cavity C, in which the molten metal supplied to the sleeve 30 is injected into the cavity C through a runner R linking the sleeve 30 with the cavity C. A plurality of protrusions 22 are provided in the runner R, the plurality of protrusions 22 extending in a direction in which the molten metal flows and being arranged in a comb-teeth arrangement in a width direction of the runner R.
    Type: Application
    Filed: May 8, 2019
    Publication date: January 2, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroyoshi NAKANO, Yuji INOUE, Shingo OGURA, Yuta TANAKA, Toshimitsu YAMADA, Yutaka YOSHIDA
  • Patent number: 10486398
    Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: November 26, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Shingo Ogura, Takaharu Hondo, Takeshi Shiojiri
  • Publication number: 20190327829
    Abstract: A stretchable board includes: a substrate having a stretching property; and a conductor portion provided on the substrate, wherein the conductor portion comprises: conductor wires intersecting with each other; and an opening surrounded by the conductor wires.
    Type: Application
    Filed: February 6, 2017
    Publication date: October 24, 2019
    Applicant: Fujikura Ltd.
    Inventors: Shingo OGURA, Tatsuo SUEMASU, Hiroyuki HIRANO, Masaaki ISHI
  • Patent number: 10345936
    Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: July 9, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Shingo Ogura, Takaharu Hondo, Takeshi Shiojiri
  • Patent number: 10306755
    Abstract: A stretchable board includes: a base material having stretchability; first and second electronic components mounted on the base material; a wire arranged on the base material; and first and second connectors for connecting the first and second electronic components and the wire to each other. At least a portion of the first electronic component and at least a portion of the second electronic component face each other in a planned stretching direction in which the base material includes: a facing zone interposed between the first and second electronic components in a planned stretching direction and a non-facing zone other than the facing zone on the base material, in which at least a portion of the first connector or at least a portion of the second connector are arranged in the non-facing zone, and in which at least one of the wires is arranged in the non-facing zone.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: May 28, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Shingo Ogura, Tetsu Hammura
  • Patent number: 10251262
    Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: April 2, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Publication number: 20190073065
    Abstract: A wiring body that includes a resin portion and a single conductive material conductor portion that is disposed on the resin portion and is formed of a single conductive material. The conductor portion includes: a main body portion and a protruding portion. The main body portion includes a contact surface in contact with the resin portion and a top surface on a side opposite to the contact surface. The protruding portion, when viewed in a cross-sectional view, is disposed on at least one end portion of the top surface and protrudes away from the resin portion.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 7, 2019
    Applicant: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Publication number: 20190018524
    Abstract: A wiring body includes: a first lead wire that is connected to a first electrode; and a second lead wire that is connected to a second electrode. The first lead wire includes: a first connection portion that is connected to the first electrode; and a first linear portion that has a first end portion connected to the first connection. The second lead wire includes: a second connection portion that is connected to the second electrode; and a second linear portion that has a second end portion connected to the second connection. The first linear portion includes: a first portion that is disposed on a side of the first end portion with respect to the second end portion in the first direction; and a second portion that is disposed on a side opposite to the first end portion with respect to the second end portion in the first direction.
    Type: Application
    Filed: December 22, 2016
    Publication date: January 17, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Takeshi Shiojiri, Shingo Ogura
  • Patent number: 10104779
    Abstract: A stretchable circuit board includes: a stretchable base; a stretchable wiring formed on the stretchable base; an electronic component mounted on the stretchable base; and a connecting section that electrically connects between the electronic component and the stretchable wiring, and is stretchable and formed such that its Young's modulus is greater than or equal to that of the stretchable wiring. In addition, the stretchable circuit board includes a stretchable insulating film formed on the stretchable base and the stretchable wiring excluding a place where the connecting section is formed.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: October 16, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Shingo Ogura
  • Publication number: 20180263114
    Abstract: A stretchable board includes: a base material having stretchability; first and second electronic components mounted on the base material; a wire arranged on the base material; and first and second connectors for connecting the first and second electronic components and the wire to each other. At least a portion of the first electronic component and at least a portion of the second electronic component face each other in a planned stretching direction in which the base material includes: a facing zone interposed between the first and second electronic components in a planned stretching direction and a non-facing zone other than the facing zone on the base material, in which at least a portion of the first connector or at least a portion of the second connector are arranged in the non-facing zone, and in which at least one of the wires is arranged in the non-facing zone.
    Type: Application
    Filed: December 8, 2015
    Publication date: September 13, 2018
    Applicant: FUJIKURA LTD.
    Inventors: Shingo Ogura, Tetsu Hammura
  • Publication number: 20180249576
    Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.
    Type: Application
    Filed: January 28, 2016
    Publication date: August 30, 2018
    Applicant: FUJIKURA LTD.
    Inventor: Shingo Ogura