Patents by Inventor Shingo Ohsaka
Shingo Ohsaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6887739Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: July 3, 2003Date of Patent: May 3, 2005Assignees: Renesas Technology Corp., Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6764878Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: July 12, 2002Date of Patent: July 20, 2004Assignees: Renesas Technology Corp., Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6759279Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: August 8, 2002Date of Patent: July 6, 2004Assignees: Renesas Technology Corp., Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20040005733Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: July 3, 2003Publication date: January 8, 2004Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6590275Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: January 31, 2002Date of Patent: July 8, 2003Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20020192872Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: August 8, 2002Publication date: December 19, 2002Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20020182776Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: July 12, 2002Publication date: December 5, 2002Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6476466Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: January 31, 2002Date of Patent: November 5, 2002Assignee: Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6448111Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: June 15, 2000Date of Patent: September 10, 2002Assignees: Hitachi Hokkai Semiconductor, Ltd., Hitachi, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6437428Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: June 16, 2000Date of Patent: August 20, 2002Assignee: Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20020079579Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: January 31, 2002Publication date: June 27, 2002Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20020070462Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: January 31, 2002Publication date: June 13, 2002Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Publication number: 20010015489Abstract: In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: ApplicationFiled: April 26, 2001Publication date: August 23, 2001Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
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Patent number: 6232650Abstract: In a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive material on a surface of a flexible film substrate. Plural bump electrodes are arranged in an array on the opposite side of said substrate and the semiconductor chip is sealed by a resin. In this regard, an insulation layer is formed to cover an electric conductor layer pattern formed on the surface of the substrate, and the semiconductor chip is mounted through an adhesive material on the insulation layer. The insulation layer is divided into a plural number of parts that are mutually discontinuous in the area under the semiconductor chip. By this divided insulation layer, a short circuit between the semiconductor chip and the electric conductor layer pattern is prevented and a deformation of the substrate that comprises the flexible films is suppressed.Type: GrantFiled: July 30, 1998Date of Patent: May 15, 2001Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.Inventors: Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani