Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film 13 in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the plurality of lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the second thermoplastic resin is equal to or lower than the softening point of the first thermoplastic resin.

Abstract: A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film (13) in such a manner as to cover a plurality of solder precoats (11) formed on a plurality of lands (10b) on a substrate and an antioxidation film (12) formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components (30) on the plurality of solder precoats (11) via the antioxidation film (12) and the temporary fixing film (13); and a step (iii) of soldering the plurality of electronic components (30) to the lands (10b) by melting the plurality of solder precoats (11). The antioxidation film (12) contains a first thermoplastic resin. The temporary fixing film (13) contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

Abstract: An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Abstract: In a regenerative braking emergency stop system, a substation includes: a rectifier transformer configured to transform AC power received from outside; a rectifier configured to convert the transformed AC power into DC power; and a switch disposed on an electrical path between the rectifier and a power-feed rail and configured to be in a closed state or an opened state; a simulated ripple transmitter configured to transmit a simulated ripple, the simulated ripple being an AC signal having a predetermined frequency; a superimposing circuit connected to the power-feed rail in parallel with the rectifier and configured to superimpose the simulated ripple transmitted from the simulated ripple transmitter on DC power outputted from the rectifier; and a relay device configured to allow the simulated ripple transmitter to transmit the simulated ripple when the rectifier is receiving power from outside and the switch is in a closed state.

Abstract: In a regenerative braking emergency stop system, a substation includes: a rectifier transformer configured to transform AC power received from outside; a rectifier configured to convert the transformed AC power into DC power; and a switch disposed on an electrical path between the rectifier and a power-feed rail and configured to be in a closed state or an opened state; a simulated ripple transmitter configured to transmit a simulated ripple, the simulated ripple being an AC signal having a predetermined frequency; a superimposing circuit connected to the power-feed rail in parallel with the rectifier and configured to superimpose the simulated ripple transmitted from the simulated ripple transmitter on DC power outputted from the rectifier; and a relay device configured to allow the simulated ripple transmitter to transmit the simulated ripple when the rectifier is receiving power from outside and the switch is in a closed state.

Abstract: The organozirconium composite of the present invention has a decomposition temperature which is near the respective decomposition temperatures of an organolead compound and an organotitanium compound. The raw material solution can precisely control the composition of a PZT thin film over a broad temperature range. The raw material solution is less likely to react an organolead compound even when mixed with the organolead compound. The present invention provides a raw material solution which is less likely to cause vapor phase cracking.

Abstract: The organozirconium composite of the present invention has a decomposition temperature which is near the respective decomposition temperatures of an organolead compound and an organotitanium compound. The raw material solution can precisely control the composition of a PZT thin film over a broad temperature range. The raw material solution is less likely to react an organolead compound even when mixed with the organolead compound. The present invention provides a raw material solution which is less likely to cause vapor phase cracking.

Abstract: An organozirconium compound comprises zirconium complexed with a &bgr;-diketone compound and an alkoxy group having a branched alkyl group, and which has formula (1): wherein R is a branched alkyl group having 4 or 5 carbons; and L1, L2, and L3, the same or different from each other, are each a &bgr;-diketone compound.