Patents by Inventor Shingo Osawa

Shingo Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polysilane and polysilane-containing resin composition
    Patent number: 8163863
    Abstract: A polysilane having excellent functionalities (e.g., solubility in a solvent and reactivity) is obtained by introducing a structural unit of the following formula (1) to a polysilane through a reaction of a dihalosilane having a Si—H bond and adding a hydrosilylatable compound (e.g., a compound having a carbon-carbon unsaturated bond) to the Si—H bond, wherein R1 represents a hydrogen atom, an organic group, or a silyl group; and “n” denotes an integer of not less than 1.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: April 24, 2012
    Assignee: Osaka Gas Co., Ltd.
    Inventors: Hiroki Sakamoto, Hiroaki Murase, Tsuyoshi Fujiki, Shingo Osawa, Yoshiyuki Morita, Tetsuya Hosomi, Nobuaki Aoki
  • POLYSILANE AND POLYSILANE-CONTAINING RESIN COMPOSITION
    Publication number: 20090156775
    Abstract: A polysilane having excellent functionalities (e.g., solubility in a solvent and reactivity) is obtained by introducing a structural unit of the following formula (1) to a polysilane through a reaction of a dihalosilane having a Si—H bond and adding a hydrosilylatable compound (e.g., a compound having a carbon-carbon unsaturated bond) to the Si—H bond, wherein R1 represents a hydrogen atom, an organic group, or a silyl group; and “n” denotes an integer of not less than 1.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 18, 2009
    Applicant: OSAKA GAS CO., LTD.
    Inventors: Hiroki Sakamoto, Hiroaki Murase, Tsuyoshi Fujiki, Shingo Osawa, Yoshiyuki Morita, Tetsuya Hosomi, Nobuaki Aoki