Patents by Inventor SHINGO OTSUKI

SHINGO OTSUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10626297
    Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives, has a pH of 6.0 or more to 9.0 or less, and is used for polishing ceramic.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: April 21, 2020
    Assignee: FUJIMI INCORPORATED
    Inventors: Kazusei Tamai, Shingo Otsuki, Tomoya Ikedo, Shota Hishida, Hiroshi Asano, Maiko Asai, Yuuichi Ito
  • Publication number: 20170355882
    Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives made of carbide, and is used for polishing ceramic.
    Type: Application
    Filed: November 26, 2015
    Publication date: December 14, 2017
    Applicant: FUJIMI INCORPORATED
    Inventors: Shingo OTSUKI, Tomoya IKEDO, Shota HISHIDA, Hitoshi MORINAGA, Maiko ASAI, Yuuichi ITO
  • Publication number: 20170355881
    Abstract: Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives, has a pH of 6.0 or more to 9.0 or less, and is used for polishing ceramic.
    Type: Application
    Filed: November 26, 2015
    Publication date: December 14, 2017
    Applicant: FUJIMI INCORPORATED
    Inventors: Kazusei TAMAI, Shingo OTSUKI, Tomoya IKEDO, Shota HISHIDA, Hiroshi ASANO, Maiko ASAI, Yuuichi ITO
  • Publication number: 20160236314
    Abstract: A polishing device includes a motor movement mechanism and a second motor that rotates a workpiece. The motor movement mechanism moves the workpiece in a direction tangential to a radially outer circumferential surface of a polishing member and moves the workpiece in a direction orthogonal to a rotational axis of the polishing member.
    Type: Application
    Filed: October 2, 2014
    Publication date: August 18, 2016
    Applicant: FUJIMI INCORPORATED
    Inventors: Hitoshi MORINAGA, Hiroshi ASANO, Shingo OTSUKI, Kazusei TAMAI
  • Publication number: 20160236322
    Abstract: A polishing device includes a polishing member, a tool, and a contact mechanism. The polishing member includes a polishing surface that is shaped in conformance with the shape of an end of a workpiece. The tool functions as a shape-processing cutting tool or a surface modifying tool that has the same shape as the shape of the end. The shape-processing cutting tool processes the polishing surface of the polishing member to be shaped in conformance with the shape of the end. The surface modifying tool modifies the polishing surface to be shaped in conformance with the shape of the portion to be polished. The contact mechanism brings the tool into contact with the polishing surface of the polishing member.
    Type: Application
    Filed: October 2, 2014
    Publication date: August 18, 2016
    Applicant: FUJIMI INCORPORATED
    Inventors: Hitoshi MORINAGA, Hiroshi ASANO, Shingo OTSUKI, Kazusei TAMAI
  • Publication number: 20160167192
    Abstract: The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.
    Type: Application
    Filed: August 6, 2014
    Publication date: June 16, 2016
    Applicant: FUJIMI INCORPORATED
    Inventors: Shingo OTSUKI, Hitoshi MORINAGA, Kazusei TAMAI, Hiroshi ASANO, Yuuichi ITOU, Souma TAGUCHI
  • Publication number: 20150306727
    Abstract: A polishing method includes a polishing process of polishing a surface to be polished of an object by relatively rotating a holding fixture and a polishing pad with the surface to be polished of the object held on the holding fixture being pressed against and placed in contact with the polishing pad, while supplying a polishing composition onto the polishing pad. During the polishing process, the object held on the holding fixture turns around with the surface to be polished of the object facing the polishing pad to change the orientation of the object.
    Type: Application
    Filed: March 27, 2015
    Publication date: October 29, 2015
    Applicant: FUJIMI INCORPORATED
    Inventors: SHINGO OTSUKI, Hiroshi Asano