Abstract: A sole structure for a shoe includes an upper wall portion disposed on the upper side, a lower wall portion disposed below and away from the upper wall portion, and a sidewall portion that is disposed between the upper wall portion and the lower wall portion and that is elastically deformable in the vertical direction. The upper and lower wall portions and the sidewall portion are formed of resin-made wall-shaped members. A three-dimensional elastic fiber structure formed of resin fibers is provided in the interior region between the upper wall portion and the lower wall portion. The interior region includes a hollow portion that is in contact with the three-dimensional elastic fiber structure via a partition wall formed of a resin-made wall-shaped member.

Abstract: An object of the present invention is to provide a sole of a baseball spike shoe that improves a ball speed in a pitching motion. A sole includes a plurality of first protrusions arranged in a forefoot region of a sole body. Each of the first protrusions is formed such that its longitudinal direction extends along a foot width direction in a bottom view. When the plurality of first protrusions are projected on a virtual projection plane as viewed from a front side of the sole body, the sum of projection lengths of the plurality of first protrusions in the foot width direction is 85% or more and 100% or less of a distance of a straight line connecting in the foot width direction a side of the most medial first protrusion to a side of the most lateral first protrusion.

Abstract: A stud for an outsole includes: an outer tubular portion located on an outsole body and having a tubular shape; and a core portion located inside the outer tubular portion. The outer tubular portion is integral with the outsole body with no seam between the outer tubular portion and the outsole body. An inner wall surface of the outer tubular portion surrounds, and is in contact with, a side surface of the core portion. This configuration reduces separation of the stud from the outsole and firmly holds the stud on the outsole.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.

Abstract: An object of the present invention is to provide a sole of a baseball spike shoe that improves a ball speed in a pitching motion. A sole includes a plurality of first protrusions arranged in a forefoot region of a sole body. Each of the first protrusions is formed such that its longitudinal direction extends along a foot width direction in a bottom view. When the plurality of first protrusions are projected on a virtual projection plane as viewed from a front side of the sole body, the sum of projection lengths of the plurality of first protrusions in the foot width direction is 85% or more and 100% or less of a distance of a straight line connecting in the foot width direction a side of the most medial first protrusion to a side of the most lateral first protrusion.

Abstract: In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.

Abstract: A sole structure for a shoe includes an upper wall portion disposed on the upper side, a lower wall portion disposed below and away from the upper wall portion, and a sidewall portion that is disposed between the upper wall portion and the lower wall portion and that is elastically deformable in the vertical direction. The upper and lower wall portions and the sidewall portion are formed of resin-made wall-shaped members. A three-dimensional elastic fiber structure formed of resin fibers is provided in the interior region between the upper wall portion and the lower wall portion. The interior region includes a hollow portion that is in contact with the three-dimensional elastic fiber structure via a partition wall formed of a resin-made wall-shaped member.

Abstract: A shoe upper body of a shoe has a stretchable portion made of a stretchable material. The stretchable portion forms a region of the shoe upper body including a portion corresponding to the center of each of the medial malleolus and the lateral malleolus of a foot of a wearer of the shoe and including a position of an ankle opening. The stretchable portion is configured so as to be deformed from a non-stretched state to a stretched state and elastically recover from the stretched state to the non-stretched state.

Abstract: A method for manufacturing a sole of an article of footwear uses an additive manufacturing through a 3D printer. The sole body 20 has an inclined surface or a curved surface BL0 to be a supported surface by a support at a toe spring portion Tu/a heel-up portion Hu/a side-up portion Su. The method includes a forming process in which a plurality of pillar-shaped supports 20sp that extend from the inclined/curved surface BL0 toward the bottom surface of the sole at the time of forming the sole through the 3D printer, and a cutting process to cut at least a portion of the pillar-shaped supports 20sp.

Abstract: A sole structure includes a sole body. The sole body is a resin-made box-shaped member with a predetermined thickness and an interior space that is defined by an upper wall portion disposed on an upper side, a lower wall portion disposed on a lower side and spaced apart from the upper wall portion, and a pair of sidewall portions disposed between and interconnecting the upper wall portion and the lower wall portion in a heel region or a forefoot region that respectively corresponds to a heel portion or a forefoot portion of a foot of a shoe wearer. The sidewall portions are elastically deformable in a vertical direction and have a plurality of solid or hollow ribs that extend in a substantially vertical direction between the upper wall portion and the lower wall portion.

Abstract: In a power semiconductor device, power semiconductor elements are mounted on a large die pad and the like. The large die pad is joined to a power lead via a lead stepped portion. The large die pad has a first end portion and a second end portion located with a distance therebetween in the X axis direction. In the Y axis direction, the lead stepped portion is joined to the first end portion side relative to a central line between the first end portion and the second end portion. The large die pad is inclined such that a distance between the large die pad and the first main surface of the molding resin is longer from the first end portion toward the second end portion.

Abstract: A method for producing a sole structure member includes: selecting at least one first sub-member from an optional group consisting of a plurality of types of first sub-members premolded such that their respective recesses have different configurations; inserting, and housing, the at least one first sub-member selected from the optional group in a housing; and molding the first and second sub-members so as to be integrated together through injection of the second resin material heated to melt, from a gate into a molding space and a channel.

Abstract: A sole structure includes a plate placed between an outsole and a midsole and disposed at the position corresponding to at least the forefoot and the midfoot of a wearer's foot, and a cushioning body disposed so as to face the sole of the wearer's foot at the position corresponding to the midfoot and the hindfoot of the wearer's foot and capable of absorbing a vertical impact on the upper surface of the cushioning body. The cushioning body and the plate body overlap each other in the vertical direction at the position corresponding to the midfoot of the wearer's foot.

Abstract: A sole structure includes an upper midsole made of an elastic material and a lower midsole made of an elastic material and bonded from below to the upper midsole. The upper midsole has first protrusions protruding toward the lower midsole, and the tip ends of the first protrusions are in contact with the lower midsole such that the tip ends of the first protrusions can move with respect to the lower midsole.

Abstract: A sole structure includes a plate placed between an outsole and a midsole. The plate includes a plate body and first openings. The plate body is made of a material less stretchable than the material of the outsole and is in the form of a thin plate. Each of the first openings extends through a part of the plate body in the vertical direction. The first openings are disposed at a position corresponding to the forefoot and the midfoot on the medial side of a wearer's foot and is covered by the outsole from below.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.

Abstract: A semiconductor device has a substrate, a semiconductor element, an electrode lead, and a sealing resin portion. The substrate has a main surface on which a circuit pattern is formed. The semiconductor element has first and second surfaces, and is arranged on the substrate such that the first surface faces the main surface. The electrode lead has one end joined to the circuit pattern and the other end joined by soldering to the second surface. The other end has a plurality of portions divided from each other. The sealing resin portion seals the semiconductor element and the electrode lead. Thus, there can be provided a semiconductor device that has relieved thermal stress at a joining portion of the electrode lead, and therefore is less subject to fatigue failure.

Abstract: A semiconductor device which includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, at least one semiconductor chip mounted on the wiring patterned layer. The semiconductor chip has a surface electrode. The semiconductor device further includes a conductive lead plate electrically connected with the surface electrode of the semiconductor chip, and a resin package of thermoplastic resin having anisotropic linear expansion coefficient varying based upon directions. The resin package covers the wiring patterned layer, the semiconductor chip, the conductive lead plate, and at least a portion of the radiating plate. The conductive lead plate extends in a direction which provides the resin package with the maximum linear expansion coefficient. In the semiconductor device so structured, the warpage of the resin package is reduced both in longitudinal and transverse directions.

Abstract: A semiconductor device has a substrate, a semiconductor element, an electrode lead, and a sealing resin portion. The substrate has a main surface on which a circuit pattern is formed. The semiconductor element has first and second surfaces, and is arranged on the substrate such that the first surface faces the main surface. The electrode lead has one end joined to the circuit pattern and the other end joined by soldering to the second surface. The other end has a plurality of portions divided from each other. The sealing resin portion seals the semiconductor element and the electrode lead. Thus, there can be provided a semiconductor device that has relieved thermal stress at a joining portion of the electrode lead, and therefore is less subject to fatigue failure.